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参数资料
型号： DS21554L+
厂商： Maxim Integrated Products
文件页数： 123/124页
文件大小： 0K
描述： IC TXRX E1 1-CHIP 5V 100-LQFP
产品培训模块： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装： 90
功能： 单芯片收发器
接口： E1，HDLC，J1，T1
电路数： 1
电源电压： 4.75 V ~ 5.25 V
电流 - 电源： 75mA
工作温度： 0°C ~ 70°C
安装类型： 表面贴装
封装/外壳： 100-LQFP
供应商设备封装： 100-LQFP（14x14）
包装： 托盘
包括： 远程和 AIS 警报检测器 / 发生器
产品目录页面： 1430 (CN2011-ZH PDF)
DS21354/DS21554 3.3V/5V E1 Single-Chip Transceivers
98 of 124
17.
INTERLEAVED PCM BUS OPERATION
In many architectures, the outputs of individual framers are combined into higher speed serial buses to
simplify transport across the system. The DS21354/DS21554 can be configured to allow data and
signaling buses to be multiplexed into higher speed data and signaling buses eliminating external
hardware saving board space and cost.
The interleaved PCM bus option (IBO) supports two bus speeds. The 4.096 MHz bus speed allows two
SCTs to share a common bus. The 8.192MHz bus speed allows four SCTs to share a common bus. See
Figure 17-1 for an example of four devices sharing a common 8.192MHz PCM bus. Each SCT that shares
a common bus must be configured through software and requires the use of one or two device pins. The
elastic stores of each SCT must be enabled and configured for 2.048MHz operation. See Figure 17-1 and
Table 17-1.
For all bus configurations, one SCT will be configured as the master device and the remaining SCTs will
be configured as slave devices. In the 4.096MHz bus configuration there is one master and one slave. In
the 8.192MHz bus configuration there is one master and three slaves. Refer to the IBO register
description for more detail.
IBO: INTERLEAVE BUS OPERATION REGISTER (Address = B5 Hex)
(MSB)
(LSB)
—
IBOEN
INTSEL
MSEL0
MSEL1
SYMBOL
POSITION
NAME AND DESCRIPTION
—
IBO.6
Not Assigned. Should be set to 0.
—
IBO.6
Not Assigned. Should be set to 0.
—
IBO.5
Not Assigned. Should be set to 0.
—
IBO.4
Not Assigned. Should be set to 0.
IBOEN
IBO.3
Interleave Bus Operation Enable
0 = Interleave Bus Operation disabled.
1 = Interleave Bus Operation enabled.
INTSEL
IBO.2
Interleave Type Select
0 = Byte interleave.
1 = Frame interleave.
MSEL0
IBO.1
Master Device Bus Select Bit 0. See Table 17-1.
MSEL1
IBO.0
Master Device Bus Select Bit 1. See Table 17-1.
Table 17-1. IBO Master Device Select
MSEL1
MSEL0
FUNCTION
0
Slave device.
0
1
Master device with 1 slave device (4.096MHz bus rate)
1
0
Master device with 3 slave devices (8.192MHz bus rate)
1
Reserved
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参数描述
DS21554L+ 功能描述:网络控制器与处理器 IC 3.3/5V E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21554LB 功能描述:网络控制器与处理器 IC 3.3/5V E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21554LB+ 功能描述:网络控制器与处理器 IC 3.3/5V E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21554LBN 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21554LBN+ 功能描述:网络控制器与处理器 IC 3.3/5V E1 Transceiver RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
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