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参数资料
型号： DS21FF42
厂商： Maxim Integrated Products
文件页数： 1/114页
文件大小： 0K
描述： IC FRAMER T1 4X4 16CH 300-BGA
产品培训模块： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装： 40
控制器类型： T1 调帧器
接口： 并行/串行
电源电压： 2.97 V ~ 3.63 V
电流 - 电源： 300mA
工作温度： 0°C ~ 70°C
安装类型： 表面贴装
封装/外壳： 300-BBGA
供应商设备封装： 300-PBGA（27x27）
包装： 管件
1 of 114
080702
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, click here: http://www.maxim-ic.com/errata.
FEATURESP
§ 16 or 12 completely independent T1 framers
in one small 27mm x 27mm, 1.27mm pitch
BGA package
§ Each multichip module (MCM) contains
four (FF) or three (FT) DS21Q42 die
§ Each quad framer can be concatenated into a
single 8.192MHz backplane data stream
§ IEEE 1149.1 JTAG-Boundary Scan
Architecture
§ DS21FF42 and DS21FT42 are pin
compatible with DS21FF44 and DS21FT44,
respectively, to allow the same footprint to
support T1 and E1 applications
§ 300-pin MCM 1.27mm pitch BGA package
(27mm x 27mm)
§ Low-power 3.3V CMOS with 5V tolerant
input and outputs
APPLICATIONS
§ DSLAMs
§ Multiplexers/Demultiplexers
§ Switches
§ High-Density Line Cards
ORDERING INFORMATION
PART
CHANNEL
PIN-PACKAGE
TEMP RANGE
DS21FT42
12
300 BGA, 27mm x 27mm
0°C to +70°C
DS21FT42N
12
300 BGA, 27mm x 27mm
-40°C to +85°C
DS21FF42
16
300 BGA, 27mm x27mm
0°C to +70°C
DS21FF42N
16
300 BGA, 27mm x 27mm
-40°C to +85°C
1. MULTICHIP MODULE DESCRIPTION
The 4 x 4 and 4 x 3 multichip modules (MCM) offer a high-density packaging arrangement for the
DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these
devices is packaged in an MCM with the electrical connections as shown in Figure 1-1.
All of the functions available on the DS21Q42 are also available in the MCM packaged version.
However, in order to minimize package size, some signals have been deleted or combined. These
differences are detailed in Table 1-1. In the 4 x 3 (FT) version, the fourth quad framer is not populated
and hence all of the signals to and from this fourth framer are absent and should be treated as No
Connects (NC). Table 2-1 lists all of the signals on the MCM and it also lists the absent signals for the
4 x 3.
The availability of both a 12-channel and a 16-channel version allow the maximum framer density with
the lowest cost. For example, in a T3 application, two devices (one DS21FF42 and one DS21FT42)
provide 28 framers without the additional cost and power consumption of any unused framers that appear
in an octal approach.
DS21FT42/DS21FF42
4 x 3 12-Channel T1 Framer
4 x 4 16-Channel T1 Framer
www.maxim-ic.com
相关PDF资料
PDF描述
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相关代理商/技术参数
参数描述
DS21FF42+ 功能描述:网络控制器与处理器 IC 4x4 16/4x3 12 Chnl T1/T1 Framer RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21FF42N 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21FF42N+ 功能描述:网络控制器与处理器 IC 4x4 16/4x3 12 Chnl T1/T1 Framer RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21FF44 功能描述:网络控制器与处理器 IC 4x4 16/4x3 12 Chnl E1/E1 Framer RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS21FF44N 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
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