参数资料
型号: DS3112N+
厂商: Maxim Integrated Products
文件页数: 133/133页
文件大小: 0K
描述: IC MUX TEMPE T3/E3 256-BGA
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 40
控制器类型: 调帧器,多路复用器
接口: 并行/串行
电源电压: 3.135 V ~ 3.465 V
电流 - 电源: 150mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 256-LBGA
供应商设备封装: 256-PBGA(27x27)
包装: 管件
DS3112
99 of 133
11 JTAG
The DS3112 device supports the standard instruction codes SAMPLE/PRELOAD, BYPASS, and
EXTEST. Optional public instructions included are HIGHZ, CLAMP, IDCODE (Figure 11-1). The
DS3112 contains the following items that meet the requirements set by the IEEE 1149.1 Standard Test
Access Port and Boundary Scan Architecture:
Test Access Port (TAP)
TAP Controller
Instruction Register
Bypass Register
Boundary Scan Register
Device Identification Register
The Test Access Port has the necessary interface pins, namely JTCLK,
JTRST, JTDI, JTDO, and JTMS.
Details on these pins can be found in Section 2.9. Details on the Boundary Scan Architecture and the Test
Access Port can be found in IEEE 1149.1-1990, IEEE 1149.1a-1993, and IEEE 1149.1b-1994.
Figure 11-1. JTAG Block Diagram
Boundary Scan
Register
Identification
Register
Bypass
Register
Instruction
Register
Test Access Port
Controller
Mux
Select
Tri-State
JTDI
10K
JTMS
10K
JTCLK
JTRST
10K
JTDO
相关PDF资料
PDF描述
DS3112 IC MUX TEMPE T3/E3 256-BGA
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