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| 型号： | DS3112N+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 6/133页 |
| 文件大小： | 0K |
| 描述： | IC MUX TEMPE T3/E3 256-BGA |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 40 |
| 控制器类型： | 调帧器，多路复用器 |
| 接口： | 并行/串行 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 电流 - 电源： | 150mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-PBGA（27x27） |
| 包装： | 管件 |
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DS3112
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11.2
Instruction Register and Instructions
The Instruction register contains a shift register as well as a latched parallel output and is 3 bits in length.
When the TAP controller enters the Shift-IR state, the instruction shift register will be connected between
JTDI and JTDO. While in the Shift-IR state, a rising edge on JTCLK with JTMS low will shift data one
stage towards the serial output at JTDO. A rising edge on JTCLK in the Exit1-IR state or the Exit2-IR
state with JTMS high will move the controller to the Update-IR state. The falling edge of that same
JTCLK will latch the data in the instruction shift register to the instruction parallel output. Instructions
supported by the DS3112 and their respective operational binary codes are shown in
Table 11-1. Instruction Codes
INSTRUCTIONS
SELECTED REGISTER
INSTRUCTION CODES
SAMPLE/PRELOAD
Boundary Scan
010
BYPASS
Bypass
111
EXTEST
Boundary Scan
000
CLAMP
Bypass
011
HIGH-Z
Bypass
100
IDCODE
Device Identification
001
11.2.1 SAMPLE/PRELOAD
A mandatory instruction for the IEEE 1149.1 specification that supports two functions. The digital I/Os of
the DS3112 can be sampled at the Boundary Scan register without interfering with the normal operation
of the device by using the Capture-DR state. SAMPLE/PRELOAD also allows the DS3112 to shift data
into the Boundary Scan register via JTDI using the Shift-DR state.
11.2.2 EXTEST
EXTEST allows testing of all interconnections to the DS3112. When the EXTEST instruction is latched
in the instruction register, the following actions occur. Once enabled via the Update-IR state, the parallel
outputs of all digital output pins will be driven. The Boundary Scan register will be connected between
JTDI and JTDO. The Capture-DR will sample all digital inputs into the Boundary Scan register.
11.2.3 BYPASS
When the BYPASS instruction is latched into the parallel Instruction register, JTDI connects to JTDO
through the one-bit Bypass Test register. This allows data to pass from JTDI to JTDO not affecting the
device's normal operation.
11.2.4 IDCODE
When the IDCODE instruction is latched into the parallel Instruction register, the Identification Test
register is selected. The device identification code will be loaded into the Identification register on the
rising edge of JTCLK following entry into the Capture-DR state. Shift-DR can be used to shift the
identification code out serially via JTDO. During Test-Logic-Reset, the identification code is forced into
the instruction register's parallel output. The device ID code will always have a one in the LSB position.
The next 11 bits identify the manufacturer’s JEDEC number and number of continuation bytes followed
by 16 bits for the device and 4 bits for the version. The device ID code for the DS3112 is 0000B143h.
11.2.5 HIGHZ
All digital outputs will be placed into a high impedance state. The Bypass Register will be connected
between JTDI and JTDO.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DS3112N+ | 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
| DS3112N+W | 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
| DS3112NC1 | 制造商:Maxim Integrated Products 功能描述:T3 E3 MULTIPLEXER, 3.3V T3/E3 FRAMER AND M13/E13/G.747 MUX - Rail/Tube |
| DS3112ND1E | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| DS3112RD | 功能描述:网络控制器与处理器 IC RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
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