参数资料
型号: DS80C390-FCR
厂商: MAXIM INTEGRATED PRODUCTS INC
元件分类: Microcontroller
英文描述: 8-BIT, MROM, 100 MHz, MICROCONTROLLER, PQFP64
封装: LQFP-64
文件页数: 29/54页
文件大小: 2030K
代理商: DS80C390-FCR
DS80C390 Dual CAN High-Speed Microprocessor
35 of 54
INTERNAL MOVX SRAM
The DS80C390 contains 4kB of SRAM that can be configured as user accessible MOVX memory, program
memory, or optional stack memory. The specific configuration and locations are governed by the internal data
memory configuration bits (IDM1, IDM0) in the memory control register (MCON;C6h). Note that when the SA bit
(ACON.2) is set, the first 1kB of the MOVX data memory is reserved for use by the 10-bit expanded stack. Internal
memory accesses will not generate
WR, RD, or PSEN strobes.
The DS80C390 can configure its 4kB of internal SRAM as combined program and data memory. This allows the
application software to execute self-modifiable code. The technique loads the 4kB SRAM with bootstrap loader
software, and then modifies the IDM1 and IDM0 bits to map the 4kB starting at memory location 40000h. This
allows the system to run the bootstrap loader without disturbing the 4MB external memory bus, making the device
in-system reprogrammable for flash or NV RAM.
Table 5. Internal MOVX SRAM Configuration
MEMORY
IDM1
IDM0
CMA
MOVX DATA
CAN MESSAGE
SHARED PROGRAM/DATA
0
00F000h–00FFFFh
00EE00h–00EFFFh
0
1
00F000h–00FFFFh
401000h–4011FFh
0
1
0
000000h–000FFFh
00EE00h–00EFFFh
0
1
000000h–000FFFh
401000h–4011FFh
1
0
400000h–400FFFh
00EE00h–00EFFFh
1
0
1
400000h–400FFFh
401000h–4011FFh
1
0
00EE00h–00EFFFh
400000h–400FFFh*
1
401000h–4011FFh
400000h–400FFFh*
*10-bit expanded stack is not available in shared program/data memory mode.
EXTERNAL MEMORY ADDRESSING
The enabling and mapping of the chip-enable signals is done through the Port 4 control register (P4CNT;92h) and
memory control register (MCON; 96h). Table 7 shows which chip-enable and address line signals are active on
Port 4. Following reset, the device will be configured with P4.7–P4.4 as address lines and P4.3–P4.0 configured as
CE3-0, with the first program fetch being performed from 00000h with CE0 active. The following tables illustrate
which memory ranges are controlled by each chip enable as a function of which address lines are enabled.
Table 6. External Memory Addressing Pin Assignments
ADDRESS/DATA
BUS
CE3–CE0
PCE3–PCE0
ADDR 19–16
ADDR 15–8
ADDR 7–0
DATA BUS
Multiplexed
P4.3–P4.0
P5.7–P5.4
P4.7–P4.4
P2
P0
Demultiplexed
P4.3–P4.0
P5.7–P5.4
P4.7–P4.4
P2
P1
P0
Table 7. Extended Address and Chip-Enable Generation
PORT 4 PIN FUNCTION
P4CNT.5–3
P4.7
P4.6
P4.5
P4.4
P4CNT.2–0
P4.3
P4.2
P4.1
P4.0
000
I/O
000
I/O
100
I/O
A16
100
I/O
CE0
101
I/O
A17
A16
101
I/O
CE1
CE0
110
I/O
A18
A17
A16
110
I/O
CE2
CE1
CE0
111(default)
A19
A18
A17
A16
111(default)
CE3
CE2
CE1
CE0
相关PDF资料
PDF描述
DS80C390-QCR 8-BIT, MROM, 100 MHz, MICROCONTROLLER, PQCC68
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DS80C390-FNR 8-BIT, 40 MHz, MICROCONTROLLER, PQFP64
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相关代理商/技术参数
参数描述
DS80C390-FCR+ 功能描述:8位微控制器 -MCU Dual CAN High-Speed RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
DS80C390-FNR 功能描述:8位微控制器 -MCU Dual CAN High-Speed RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
DS80C390-FNR+ 功能描述:8位微控制器 -MCU Dual CAN High-Speed RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
DS80C390-QCR 功能描述:8位微控制器 -MCU Dual CAN High-Speed RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
DS80C390-QCR+ 功能描述:8位微控制器 -MCU Dual CAN High-Speed RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT