- 您现在的位置：买卖IC网 > PDF目录3851 > DSPIC30F2010-20I/MM (Microchip Technology)IC DSPIC MCU/DSP 12K 28QFN PDF资料下载
参数资料
| 型号： | DSPIC30F2010-20I/MM |
| 厂商： | Microchip Technology |
| 文件页数： | 14/66页 |
| 文件大小： | 0K |
| 描述： | IC DSPIC MCU/DSP 12K 28QFN |
| 产品培训模块： | dsPIC30F Quadrature Encoder Interface Serial Communications using dsPIC30F I2C Serial Communications using dsPIC30F SPI Serial Communications using dsPIC30F UART dsPIC30F 12 bit ADC - Part 2 dsPIC30F Addressing Modes - Part 1 dsPIC30F Architecture - Part 1 dsPIC30F DSP Engine & ALU dsPIC30F Interrupts dsPIC30F Motor Control PWM dsPIC Timers Asynchronous Stimulus dsPIC30F Addressing Modes - Part 2 dsPIC30F Architecture - Part 2 dsPIC30F 12-bit ADC Part 1 |
| 标准包装： | 61 |
| 系列： | dsPIC™ 30F |
| 核心处理器： | dsPIC |
| 芯体尺寸： | 16-位 |
| 速度： | 20 MIPS |
| 连通性： | I²C，SPI，UART/USART |
| 外围设备： | 高级欠压探测/复位，电机控制 PWM，QEI，POR，PWM，WDT |
| 输入/输出数： | 20 |
| 程序存储器容量： | 12KB（4K x 24） |
| 程序存储器类型： | 闪存 |
| EEPROM 大小： | 1K x 8 |
| RAM 容量： | 512 x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 2.5 V ~ 5.5 V |
| 数据转换器： | A/D 6x10b |
| 振荡器型： | 内部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 28-VQFN 裸露焊盘 |
| 包装： | 管件 |
| 配用： | AC164322-ND - MODULE SOCKET MPLAB PM3 28/44QFN |
| 其它名称： | DSPIC30F2010-20I/MMG DSPIC30F201020IMM DSPIC30F201020IMM-ND |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页当前第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页
2010 Microchip Technology Inc.
DS70102K-page 21
dsPIC30F Flash Programming Specification
6.6
Configuration Information in the
Hexadecimal File
To allow portability of code, the programmer must read
the
Configuration
register
locations
from
the
hexadecimal file. If configuration information is not
present in the hexadecimal file, a simple warning
message should be issued by the programmer.
Similarly, while saving a hexadecimal file, all
configuration information must be included. An option
to not include the configuration information can be
provided.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
6.7
Unit ID
The dsPIC30F devices contain 32 instructions of Unit
ID. These are located at addresses 0x8005C0 through
0x8005FF. The Unit ID can be used for storing product
information
such
as
serial
numbers,
system
manufacturing dates, manufacturing lot numbers and
other such application-specific information.
A Bulk Erase does not erase the Unit ID locations.
Instead, erase all executive memory using steps 1-4 as
shown in Table 12-1, and program the Unit ID along
with the programming executive. Alternately, use a
Row Erase to erase the row containing the Unit ID
locations.
6.8
Checksum Computation
Checksums for the dsPIC30F are 16 bits in size. The
checksum is to total sum of the following:
Contents of code memory locations
Contents of Configuration registers
Table A-1 describes how to calculate the checksum for
each device. All memory locations are summed one
byte at a time, using only their native data size. More
specifically, Configuration and device ID registers are
summed by adding the lower two bytes of these
locations (the upper byte is ignored), while code
memory is summed by adding all three bytes of code
memory.
Note:
The
checksum
calculation
differs
depending on the code-protect setting.
Table A-1 describes how to compute the
checksum for an unprotected device and
a read-protected device. Regardless of
the code-protect setting, the Configuration
registers can always be read.
7.0
PROGRAMMER –
PROGRAMMING EXECUTIVE
COMMUNICATION
7.1
Communication Overview
The programmer and programming executive have a
master-slave relationship, where the programmer is
the master programming device and the programming
executive is the slave.
All communication is initiated by the programmer in the
form of a command. Only one command at a time can
be sent to the programming executive. In turn, the
programming executive only sends one response to
the programmer after receiving and processing a
command. The programming executive command set
is described in Section 8.0 “Programming Executive
Commands”. The response set is described in
7.2
Communication Interface and
Protocol
The Enhanced ICSP interface is a 2-wire SPI interface
implemented using the PGC and PGD pins. The PGC
pin is used as a clock input pin, and the clock source
must be provided by the programmer. The PGD pin is
used for sending command data to, and receiving
response data from, the programming executive. All
serial data is transmitted on the falling edge of PGC
and latched on the rising edge of PGC. All data
transmissions are sent Most Significant bit (MSb) first,
using 16-bit mode (see Figure 7-1).
FIGURE 7-1:
PROGRAMMING
EXECUTIVE SERIAL
TIMING
Since a 2-wire SPI interface is used, and data transmis-
sions are bidirectional, a simple protocol is used to
control the direction of PGD. When the programmer
completes a command transmission, it releases the
PGD line and allows the programming executive to
drive this line high. The programming executive keeps
the PGD line high to indicate that it is processing the
command.
After the programming executive has processed the
command, it brings PGD low for 15
μsec to indicate to
the programmer that the response is available to be
PGC
PGD
12
3
11
13
15 16
14
12
LSb
14 13 12 11
45
6
MSb
1
2
3
...
4
5
P2
P3
P1
P1a
P1b
相关PDF资料 |
PDF描述 |
|---|---|
| PIC32MX150F128B-I/SO | IC MCU 32BIT 128KB FLASH 28-SOIC |
| PIC32MX230F064B-I/SO | IC MCU 32BIT 64KB FLASH 28-SOIC |
| PIC24FJ32GB002-I/ML | IC MCU 16BIT 32KB FLASH 28QFN |
| PIC16F88-I/ML | IC MCU FLASH 4KX14 EEPROM 28QFN |
| PIC18F26J53-I/ML | IC PIC MCU 64KB FLASH 28QFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DSPIC30F2010-20ISP | 功能描述:数字信号处理器和控制器 - DSP, DSC RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| DSPIC30F2010-30I | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-bit Digital Signal Controllers |
| dsPIC30F2010-30I/MM | 功能描述:数字信号处理器和控制器 - DSP, DSC 16B MCU DSP 28LD 20MIPS 12KB FLASH RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| DSPIC30F2010-30I/MMG | 功能描述:数字信号处理器和控制器 - DSP, DSC 16bit Signal Cntrlr Lead Free Package RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| DSPIC30F2010-30I/SO | 功能描述:数字信号处理器和控制器 - DSP, DSC 20MHz 12KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
发布紧急采购，3分钟左右您将得到回复。