参数资料
型号: DSPIC30F2010-20I/SP
厂商: Microchip Technology
文件页数: 45/66页
文件大小: 0K
描述: IC DSPIC MCU/DSP 12K 28DIP
产品培训模块: Asynchronous Stimulus
标准包装: 15
系列: dsPIC™ 30F
核心处理器: dsPIC
芯体尺寸: 16-位
速度: 20 MIPS
连通性: I²C,SPI,UART/USART
外围设备: 高级欠压探测/复位,电机控制 PWM,QEI,POR,PWM,WDT
输入/输出数: 20
程序存储器容量: 12KB(4K x 24)
程序存储器类型: 闪存
EEPROM 大小: 1K x 8
RAM 容量: 512 x 8
电压 - 电源 (Vcc/Vdd): 2.5 V ~ 5.5 V
数据转换器: A/D 6x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 28-DIP(0.300",7.62mm)
包装: 管件
产品目录页面: 650 (CN2011-ZH PDF)
配用: DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE
其它名称: DSPIC30F2010-20I/SPG
DSPIC30F201020ISG
DSPIC30F201020ISG-ND
DSPIC30F201020ISP
2010 Microchip Technology Inc.
DS70102K-page 5
dsPIC30F Flash Programming Specification
5.0
DEVICE PROGRAMMING
5.1
Overview of the Programming
Process
Once the programming executive has been verified
in memory (or loaded if not present), the dsPIC30F can
be programmed using the command set shown in
Table 5-1. A detailed description for each command is
TABLE 5-1:
COMMAND SET SUMMARY
Command
Description
SCHECK
Sanity check
READD
Read data EEPROM, Configuration
registers and device ID
READP
Read code memory
PROGD
Program one row of data EEPROM
and verify
PROGP
Program one row of code memory and
verify
PROGC
Program Configuration bits and verify
ERASEB
Bulk Erase, or erase by segment
ERASED
Erase data EEPROM
ERASEP
Erase code memory
QBLANK
Query if the code memory and data
EEPROM are blank
QVER
Query the software version
A high-level overview of the programming process is
illustrated in Figure 5-1. The process begins by enter-
ing Enhanced ICSP mode. The chip is then bulk
erased, which clears all memory to ‘1’ and allows the
device to be programmed. The Chip Erase is verified
before programming begins. Next, the code memory,
data Flash and Configuration bits are programmed. As
these memories are programmed, they are each
verified to ensure that programming was successful. If
no errors are detected, the programming is complete
and Enhanced ICSP mode is exited. If any of the
verifications fail, the procedure should be repeated,
starting from the Chip Erase.
If Advanced Security features are enabled, then
individual Segment Erase operations need to be
performed, based on user selections (i.e., based on the
specific needs of the user application). The specific
operations that are used typically depend on the order
in which various segments need to be programmed for
a given application or system.
describe the programming process in detail.
FIGURE 5-1:
PROGRAMMING FLOW
Start
Program and
Program and verify
Configuration bits
Finish
verify code
verify data
Enter Enhanced
Exit Enhanced ICSP
Mode
Perform Chip
Erase
Program
Configuration
registers to
ICSP mode
default value
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相关代理商/技术参数
参数描述
DSPIC30F2010-30I 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:High-Performance, 16-bit Digital Signal Controllers
dsPIC30F2010-30I/MM 功能描述:数字信号处理器和控制器 - DSP, DSC 16B MCU DSP 28LD 20MIPS 12KB FLASH RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-30I/MMG 功能描述:数字信号处理器和控制器 - DSP, DSC 16bit Signal Cntrlr Lead Free Package RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-30I/SO 功能描述:数字信号处理器和控制器 - DSP, DSC 20MHz 12KB Flash RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC30F2010-30I/SOG 功能描述:数字信号处理器和控制器 - DSP, DSC 16bit Signal Cntrlr RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT