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| 型号： | DV164136 |
| 厂商： | Microchip Technology |
| 文件页数： | 37/107页 |
| 文件大小： | 0K |
| 描述： | DEVELOPMENT KIT FOR PIC18 |
| 产品培训模块： | PIC18 J Series MCU Overview |
| 标准包装： | 1 |
| 系列： | PIC® |
| 类型： | MCU |
| 适用于相关产品： | PIC18F8722，PIC18F87J11 |
| 所含物品： | 板，线缆，CD，PICkit? 3 个编程器，电源 |
| 产品目录页面： | 659 (CN2011-ZH PDF) |
| 相关产品： | PIC18F87J11-I/PT-ND - IC PIC MCU FLASH 64KX16 80TQFP PIC18F87J11T-I/PTTR-ND - IC PIC MCU FLASH 64KX16 80TQFP PIC18F8722T-E/PT-ND - IC PIC MCU FLASH 64KX16 80TQFP PIC18F8722-E/PT-ND - IC PIC MCU FLASH 64KX16 80TQFP PIC18F8722T-I/PT-ND - IC PIC MCU FLASH 64KX16 80TQFP PIC18F8722-I/PT-ND - IC PIC MCU FLASH 64KX16 80TQFP |
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2007-2012 Microchip Technology Inc.
DS39778E-page 35
PIC18F87J11 FAMILY
2.6
External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
secondary
oscillator
(refer
to
for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-5. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins, and other
signals in close proximity to the oscillator, are benign
(i.e., free of high frequencies, short rise and fall times,
and other similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC and PICmicro Devices”
AN849, “Basic PICmicro Oscillator Design”
AN943, “Practical PICmicro Oscillator Analysis
and Design”
AN949, “Making Your Oscillator Work”
2.7
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 k
to 10 k resistor to VSS on unused pins and drive the
output to logic low.
FIGURE 2-5:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
GND
`
OSC1
OSC2
T1OSO
T1OS I
Copper Pour
Primary Oscillator
Crystal
Timer1 Oscillator
Crystal
DEVICE PINS
Primary
Oscillator
C1
C2
T1 Oscillator: C1
T1 Oscillator: C2
(tied to ground)
Single-Sided and In-Line Layouts:
Fine-Pitch (Dual-Sided) Layouts:
GND
OSCO
OSCI
Bottom Layer
Copper Pour
Oscillator
Crystal
Top Layer Copper Pour
C2
C1
DEVICE PINS
(tied to ground)
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