参数资料
型号: ECLSOIC8EVB
厂商: ON Semiconductor
文件页数: 1/20页
文件大小: 0K
描述: BOARD EVALUATION HI FREQ 8-SOIC
特色产品: Evaluation Boards & Kits
标准包装: 1
主要目的: 裸评估板
嵌入式:
已用 IC / 零件: 8-SOIC 封装
主要属性: 四层板,带分离式(双)电源
次要属性: 可容纳几种不同的设计配置
已供物品: 裸板
其它名称: ECLSOIC8EVB-ND
ECLSOIC8EVBOS
ECLSOIC8EVB
Evaluation Board User's
Manual for High Frequency
SOIC 8
http://onsemi.com
EVAL BOARD USER’S MANUAL
INTRODUCTION
ON Semiconductor has developed an evaluation board for
the devices in 8 ? lead SOIC package. These evaluation
boards are offered as a convenience for the customers
interested in performing their own engineering assessment
on the general performance of the 8 ? lead SOIC device
samples. The board provides a high bandwidth 50 W
controlled impedance environment. The pictures in Figure 1
show the top and bottom view of the evaluation board, which
can be configured in several different ways, depending on
device under test (See Table 1. Configuration List).
This evaluation board manual contains:
? Information on 8 ? lead SOIC Evaluation Board
? Assembly Instructions
? Appropriate Lab Setup
? Bill of Materials
This manual should be used in conjunction with the device
Board Lay ? Up
The 8 ? lead SOIC evaluation board is implemented in four
layers with split (dual) power supplies (Figure 2.
Evaluation Board Lay ? up). For standard ECL lab setup and
test, a split (dual) power supply is essential to enable the
50 W internal impedance in the oscilloscope as a termination
for ECL devices. The first layer or primary trace layer is
0.008 ″ thick Rogers RO4003 material, which is designed to
have equal electrical length on all signal traces from the
device under the test (DUT) to the sense output. The second
layer is the 1.0 oz copper ground plane and a portion of the
plane is the V EE power plane. The FR4 dielectric material is
placed between second and third layer and between third and
fourth layer. The third layer is also 1.0 oz copper ground
plane and a portion of this layer is V CC power plane. The
fourth layer is the secondary trace layer.
data sheet, which contains full technical details on the device
specifications and operation.
Figure 1. Top and Bottom View of the 8 ? lead SOIC Evaluation Board
? Semiconductor Components Industries, LLC, 2012
January, 2012 ? Rev. 2
1
Publication Order Number:
EVBUM2056/D
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