参数资料
| 型号： | ECLSOIC8EVB |
| 厂商： | ON Semiconductor |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION HI FREQ 8-SOIC |
| 特色产品： | Evaluation Boards & Kits |
| 标准包装： | 1 |
| 主要目的： | 裸评估板 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | 8-SOIC 封装 |
| 主要属性： | 四层板，带分离式（双）电源 |
| 次要属性： | 可容纳几种不同的设计配置 |
| 已供物品： | 裸板 |
| 其它名称： | ECLSOIC8EVB-ND ECLSOIC8EVBOS |
ECLSOIC8EVB
Appendix A (Modified Configurations)
MC10EL16D/MC100EL16D
MC100LVEL16D
MC10EP16D/MC100EP16D
MC10EP16DF/MC100EP16DF
MC100EP16VAD
MC100LVEP16D
The devices listed above have the option of being driven
single ? endedly by using the provided V BB pin of the device.
In order to drive it single ? endedly, Configuration 2 needs to
be modified.
1. Remove the 50 W chip resistor from R3.
2. Short pin 3 and pin 4 together.
Option A) Short R3 and R4 trace pads.
Or
Option B) Place a SMA connector on J4 and use
a cable with SMA connectors to short
J3 and J4 connectors.
MC10EP16D/MC100EP16DT
This device has an option of being 50 W terminated
internally. To evaluate the internal 50 W resistor of the
device, Configuration 2 needs to be modified.
1. Remove the 50 W chip resistors from R2 and R3.
2. Short R1 and R4 to V TT (GND).
Option A) Short R1 and R4 to V TT (GND).
Or
Option B) Place SMA connectors on J1 and J4.
Place shorting barrels on J1 and J4
SMA connector.
MC100EP16VBD
This device has an option of single ? ended feedback
output and being driven single ? endedly using the V BB . To
utilize the feedback option and drive it single ? endedly,
Configuration 2 needs to be modified.
Feedback option
1. Connect a SMA connector on J1
Drive single ? endedly
2. Remove the 50 W chip resistor from R3.
3. Short pin 3 and pin 4 together.
Option A) Short R3 and R4.
Or
Option B) Place a SMA connector on J4 and use
a cable with SMA connectors to short
J3 and J4 connectors.
MC100EP16VCD
This device has an option of single ? ended feedback
output with an enable pin. To utilize the feedback option and
enable option, Configuration 5 needs to be modified.
1. Connect a SMA connector on J1.
2. Remove the 50 W chip resistor from R3.
MC100EP16VSD
This device has an option of varying the output swing
amplitude and being driven single ? endedly. In order to
utilize these options, Configuration 2 needs to be modified.
Output Swing Control
1. Connect a SMA connector on J1
2. Add a decoupling capacitor between J1 and V CC
(0.01 m F)
Drive Single ? Endedly
1. Remove the 50 W chip resistor from R3.
2. Short pin 3 and pin 4 together.
Option A) Short R3 and R4.
Or
Option B) Place a SMA connector on J4 and use
a cable with SMA connectors to short
J3 and J4 connectors.
MC100EP16VTD
This device has an option of varying the output swing
amplitude and internal termination. In order to utilize these
options, Configuration 2 needs to be modified.
Output Swing Control
1. Connect a SMA connector on J1
2. Add a decoupling capacitor between J1 and V CC
(0.0 1 m F)
Internal Termination
1. Remove the 50 W chip resistors from R2 and R3.
2. Short R1 and R4 to V TT (GND)
Option A) Short R1 and R4 to V TT (GND).
Or
Option B) Place SMA connectors on J1 and J4.
Place shorting barrels on J1 and J4
SMA connector.
MC10ELT21D/MC100EL21D
MC100EL23D
MC10ELT26D/MC100ELT26D
MC100EPT21D
MC100EPT23D
MC100EPT26D
MC100LVELT23
The TTL output data presented in the data sheet are obtained
under 500 W load resistor in parallel with 20 pF fixture
capacitance. In order to obtain comparable data as in the data
sheet, the evaluation board needs to be modified.
1. Cut the output trace so that the 0402* size chip
resistor can be placed over the cut out trace.
2. Solder a 450 W chip resistor across the cut out
trace.
*Any size chip resistor can be used. The recommended size of the
chip resistor is 0402, to reduce the effect of parasitic with a 17 mil
trace width. 450 W in series with 50 W instrument resistance add up
to 500 W loaded condition.
http://onsemi.com
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