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参数资料
| 型号： | ECM004 |
| 文件页数： | 4/13页 |
| 文件大小： | 99K |
| 代理商： | ECM004 |
EiC Corp. A Subsidiary of EiC Enterprises, Ltd.
45738 Northport Loop West, Fremont, CA 94538
Phone: (510) 979-8999
Fax: (510) 979-8902
www.eiccorp.com
12
ECM001
Dual Mode Cellular CDMA/AMPS
3.5V POWER AMPLIFIER MODULE
PRELIMINARY DATA SHEET
SS-000340-000
Revision G
If a lower gain PAM is used, the driver needs to provide more power, at the expense of
more operation current and possible degradation in ACPR.
Therefore the ECM001 can replace a lower gain PAM, this allows the driver to
work at a lower output power and provide better ACPR, this improved performance
offers more design margin in the transmitter chain.
IV. Easy Shut Down and Low Leakage Current
The Vcc pin of the PAM is connected directly to the battery, therefore a shut down
FET is not required. A voltage is applied to the Vref pin, which then brings up the
quiescent current.
Removing the voltage applied to Vref pin, the quiescent current will drop to a small
leakage current, typically <10uA. The low leakage current of the PAM allows for a
longer standby time for the phone.
V. General Application
The PAM requires a minimal number of external components. Both the input and
output are dc-blocked within the PAM as shown in the function diagram. The input pin is
connected to ground through a shunt inductor within the PAM.
ECM001 is designed with a low quiescent current of 80mA typical. At full CDMA
power of 28dBm, the operation current will be greater than 500mA. Therefore it is a
“quasi class B” or “deep class AB” amplifier. The operation current increases with output
power.
CDMA signal has a time varying amplitude. The peak power is 4dB above the
average RF power (it can be more accurately defined by PDF, power density function).
As the peak power is clipped by the amplifier saturation power level, the distortion of the
signal will cause the ACPR to deteriorate rapidly. Therefore the P1dB (as tested by a
SINE wave) of the amplifier should be over 31dBm to provide good ACPR at 28 dBm of
output power.
A 100pF capacitor is required adjacent to the Vcc2 pin. In addition, a large
capacitor (>uF) is required. The CDMA signal has a time-varying amplitude; therefore
the PAM draws on operation current corresponding to the instantaneous demand by the
RF power. The large capacitor near-by is the electric charge reservoir, providing current
on demand. The long electrical path from battery behaves as a large inductor; the
instantaneous demand on current will cause a voltage drop, resulting in poor ACPR.
On the evaluation board, a large shunt capacitor is added to protect the Vref pin
from power supply over-voltage during ON/OFF. This is similar but different from the
ESD. Therefore the rise and fall time test of the power down feature needs to be tested
with the shunt capacitor on Vref pin removed.
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相关代理商/技术参数 |
参数描述 |
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| ECM02DRAN | 功能描述:CONN EDGECARD 4POS R/A .156 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:18 位置数:36 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:卡扩展器 安装类型:板边缘，跨骑式安装 端子:焊接 触点材料:磷青铜 触点表面涂层:金 触点涂层厚度:10µin（0.25µm） 触点类型：:环形波纹管 颜色:黑 包装:托盘 法兰特点:- 材料 - 绝缘体:聚酰胺（PA9T） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DREN | 功能描述:CONN EDGECARD 4POS .156 EYELET RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:28 位置数:56 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔，直角 端子:焊接 触点材料:磷青铜 触点表面涂层:金 触点涂层厚度:30µin（0.76µm） 触点类型：:全波纹管 颜色:绿 包装:托盘 法兰特点:侧面安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚苯硫醚（PPS） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DRKN | 功能描述:CONN EDGECARD 4POS DIP .156 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:28 位置数:56 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔，直角 端子:焊接 触点材料:磷青铜 触点表面涂层:金 触点涂层厚度:30µin（0.76µm） 触点类型：:全波纹管 颜色:绿 包装:托盘 法兰特点:侧面安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚苯硫醚（PPS） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DRKN-S13 | 功能描述:CONN EDGECARD 4POS .156 EXTEND RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:40 位置数:80 卡厚度:0.093"（2.36mm） 行数:2 间距:0.100"（2.54mm） 特点:- 安装类型:面板安装 端子:焊接孔眼 触点材料:铜铍 触点表面涂层:金 触点涂层厚度:10µin（0.25µm） 触点类型：:全波纹管 颜色:蓝 包装:托盘 法兰特点:侧面安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚对苯二甲酸丁二酯（PBT） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DRPN | 功能描述:CONN EDGECARD 4POS DIP .156 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:6 位置数:12 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔 端子:焊接 触点材料:磷青铜 触点表面涂层:锡 触点涂层厚度:100µin（2.54µm） 触点类型：:全波纹管 颜色:蓝 包装:托盘 法兰特点:顶部安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚对苯二甲酸丁二酯（PBT） 工作温度:-65°C ~ 125°C 读数:双 |
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