- 您现在的位置：买卖IC网 > PDF目录97874 > ECM028 PDF资料下载
参数资料
| 型号： | ECM028 |
| 文件页数： | 2/12页 |
| 文件大小： | 104K |
| 代理商： | ECM028 |
EiC Corp. A Subsidiary of EiC Enterprises, Ltd.
45738 Northport Loop West, Fremont, CA 94538
Phone: (510) 979-8999
Fax: (510) 979-8902
www.eiccorp.com
10
ECM028
Korean PCS CDMA
3.5V POWER AMPLIFIER MODULE
PRELIMINARY DATA SHEET
SS-000520-000
Revision E
ECM028 Operating Principles and Key Features
ECM028 is a 6x6mm size Power Amplifier Module (PAM) for the Korean PCS
band CDMA handset market..
The PAM utilizes InGaP HBT technology and a multi layer laminate base, over
molded modular package with a LGA signal pad.
I. In GaP HBT offers Reliability and Quality
EiCs proprietary InGaP HBT provides excellent reliability and is used in
the infrastructure industry. The InGaP HBT is inherently superior to AlGaAs
HBT. The surface defect density in InGaP is much lower than that of AlGaAs.
The HBT life test of EiC InGaP HBT has gone through 315
oC junction
temperature and 50kA/cm
2 for over 6000 hours (8 months), translating to multi-
million hours lifetime or longer in the operation envelope [1]. This kind of robust
performance is far superior to conventional AlGaAs HBT.
The InGaP HBT PAM goes through a product burn-in test as well. A large
sample group, usually 100 pieces, goes through burn-in test at an ambient
temperature of 125 to 145
oC for 1000 hours. The FIT number is than calculated
based upon the data collected. The MTTF is simply 1/FIT, this MTTF should
agree with the HBT life test results.
The agreement between the MTTF of HBT from life test and the FIT is
essential: it validates both tests! If there is a large discrepancy [2], the quality
claim may be flawed.
Although handset applications do not have as stringent operating
requirements as the infrastructure market, the high reliability of InGaP HBT offers
an assurance to the user of a high quality product designed for high volume
production.
II. InGaP HBT and Patent-pending Circuit Design Offers Low Temperature
Variation
Current gain of InGaP HBT varies about 10% over –40 to +85
oC range,
compared with 50% of AlGaAs HBT. This low gain variation over temperature,
coupled with the patent-pending circuit design approach, provides for more
stable electrical performance.
III. ECM028 Offers High Gain and Margin for Transmitter Chain Design
The typical gain of the ECM028 is 28dB. This high gain allows the driver
amplifier to run very linear which results in reduced current. Taking into account
the 3dB loss of the BPF in front of the PAM, the driver needs to deliver only
4dBm linear power. The P1dB of the driver amplifier should be more than 10dBm.
相关PDF资料 |
PDF描述 |
|---|---|
| ECM806 | |
| ECM807 | |
| ECOG1 | eCOG1 Microcontroller |
| ECP050 | |
| ECP100 | |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ECM02DRAN | 功能描述:CONN EDGECARD 4POS R/A .156 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:18 位置数:36 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:卡扩展器 安装类型:板边缘，跨骑式安装 端子:焊接 触点材料:磷青铜 触点表面涂层:金 触点涂层厚度:10µin（0.25µm） 触点类型：:环形波纹管 颜色:黑 包装:托盘 法兰特点:- 材料 - 绝缘体:聚酰胺（PA9T） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DREN | 功能描述:CONN EDGECARD 4POS .156 EYELET RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:28 位置数:56 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔，直角 端子:焊接 触点材料:磷青铜 触点表面涂层:金 触点涂层厚度:30µin（0.76µm） 触点类型：:全波纹管 颜色:绿 包装:托盘 法兰特点:侧面安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚苯硫醚（PPS） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DRKN | 功能描述:CONN EDGECARD 4POS DIP .156 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:28 位置数:56 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔，直角 端子:焊接 触点材料:磷青铜 触点表面涂层:金 触点涂层厚度:30µin（0.76µm） 触点类型：:全波纹管 颜色:绿 包装:托盘 法兰特点:侧面安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚苯硫醚（PPS） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DRKN-S13 | 功能描述:CONN EDGECARD 4POS .156 EXTEND RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:40 位置数:80 卡厚度:0.093"（2.36mm） 行数:2 间距:0.100"（2.54mm） 特点:- 安装类型:面板安装 端子:焊接孔眼 触点材料:铜铍 触点表面涂层:金 触点涂层厚度:10µin（0.25µm） 触点类型：:全波纹管 颜色:蓝 包装:托盘 法兰特点:侧面安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚对苯二甲酸丁二酯（PBT） 工作温度:-65°C ~ 125°C 读数:双 |
| ECM02DRPN | 功能描述:CONN EDGECARD 4POS DIP .156 SLD RoHS:是 类别:连接器，互连式 >> Card Edge 系列:- 标准包装:1 系列:- 卡类型:非指定 - 双边 类型:母头 Number of Positions/Bay/Row:6 位置数:12 卡厚度:0.062"（1.57mm） 行数:2 间距:0.156"（3.96mm） 特点:- 安装类型:通孔 端子:焊接 触点材料:磷青铜 触点表面涂层:锡 触点涂层厚度:100µin（2.54µm） 触点类型：:全波纹管 颜色:蓝 包装:托盘 法兰特点:顶部安装开口，无螺纹，0.125"（3.18mm）直径 材料 - 绝缘体:聚对苯二甲酸丁二酯（PBT） 工作温度:-65°C ~ 125°C 读数:双 |
发布紧急采购，3分钟左右您将得到回复。