参数资料
| 型号： | EL5525IREZ-T7 |
| 厂商： | Intersil |
| 文件页数： | 9/10页 |
| 文件大小： | 0K |
| 描述： | IC VREF GEN 18CH TFTLCD 38HTSSOP |
| 标准包装： | 1,000 |
| 应用： | 转换器，TFT，LCD |
| 输入电压： | 4.5 V ~ 16.5 V |
| 输出数： | 18 |
| 输出电压： | 0.5 V ~ 14.95 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 38-TFSOP （0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 38-TSSOP 裸露焊盘 |
| 包装： | 带卷 (TR) |
EL5525
By setting the two P DMAX equations equal to each other, we
can solve for the R LOAD s to avoid the device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat.
THERMAL SHUTDOWN
The EL5525 has an internal thermal shutdown circuitry that
prevents overheating of the part. When the junction
temperature goes up to about +150°C, the part will be
disabled. When the junction temperature drops down to
about +120°C, the part will be enabled. With this feature, any
short circuit at the outputs will enable the thermal shutdown
circuitry to disable the part.
Application Drawing
HIGH REFERENCE
POWER SUPPLY BYPASSING AND PRINTED CIRCUIT
BOARD LAYOUT
Good printed circuit board layout is necessary for optimum
performance. A low impedance and clean analog ground
plane should be used for the EL5525. The traces from the
two ground pins to the ground plane must be very short. The
thermal pad of the EL5525 should be connected to the
analog ground plane. Lead length should be as short as
possible and all power supply pins must be well bypassed. A
0.1μF ceramic capacitor must be place very close to the V S ,
V REFH , V REFL , and CAP pins. A 4.7μF local bypass
tantalum capacitor should be placed to the V S , V REFH , and
V REFL pins.
+10V
VOLTAGE
REFH
OUTA
COLUMN
(SOURCE)
0.1μF
DRIVER
+12V
0.1μF
VS
OUTB
MICROCONTROLLER
+5V
VSD
OUTC
LCD PANEL
0.1μF
OUTD
SDI
SCK
ENA
OUTE
LCD
TIMING
HORIZONTAL RATE
SDO
OSC
CONTROLLER
CAP
OUTF
0.1μF
5V
OSC_SET
+1V
0.1μF
REFL
GND
OUTQ
OUTR
EL5525
9
FN7393.2
September 21, 2010
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