参数资料
型号: EP2AGX125DF25C5N
厂商: Altera
文件页数: 9/90页
文件大小: 0K
描述: IC ARRIA II GX FPGA 125K 572FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 5
系列: Arria II GX
LAB/CLB数: 4964
逻辑元件/单元数: 118143
RAM 位总计: 8315904
输入/输出数: 260
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 572-FBGA
供应商设备封装: 572-FBGA
Chapter 1: Device Datasheet for Arria II Devices
1–9
Electrical Characteristics
December 2013
Altera Corporation
Table 1–10 lists the bus hold specifications for Arria II GZ devices.
OCT Specifications
Table 1–11 lists the Arria II GX device and differential OCT with and without
calibration accuracy.
Table 1–10. Bus Hold Parameters for Arria II GZ Devices
Parameter
Symbol
Cond.
VCCIO (V)
Unit
1.2
1.5
1.8
2.5
3.0
Min
Max
Min
Max
Min
Max
Min
Max
Min
Max
Bus-hold
Low
sustaining
current
ISUSL
VIN > VIL
(max.)
22.5
25.0
30.0
50.0
70.0
A
Bus-hold
High
sustaining
current
ISUSH
VIN < VIH
(min.)
-22.5
-25.0
-30.0
-50.0
-70.0
A
Bus-hold
Low
overdrive
current
IODL
0V < VIN <
VCCIO
120
160
200
300
500
A
Bus-hold
High
overdrive
current
IODH
0V < VIN <
VCCIO
-120
-160
-200
-300
-500
A
Bus-hold
trip point
VTRIP
0.45
0.95
0.50
1.00
0.68
1.07
0.70
1.70
0.80
2.00
V
Table 1–11. OCT With and Without Calibration Specification for Arria II GX Device I/Os (Note 1) (Part 1 of 2)
Symbol
Description
Conditions (V)
Calibration Accuracy
Unit
Commercial
Industrial
25-
R
S
3.0, 2.5
25-
series OCT
without calibration
VCCIO = 3.0, 2.5
± 30
± 40
%
50-
R
S
3.0, 2.5
50-
series OCT
without calibration
VCCIO = 3.0, 2.5
± 30
± 40
%
25-
R
S
1.8
25-
series OCT
without calibration
VCCIO = 1.8
± 40
± 50
%
50-
R
S
1.8
50-
series OCT
without calibration
VCCIO = 1.8
± 40
± 50
%
25-
R
S
1.5, 1.2
25-
series OCT
without calibration
VCCIO = 1.5, 1.2
± 50
%
50-
R
S
1.5, 1.2
50-
series OCT
without calibration
VCCIO = 1.5, 1.2
± 50
%
25-
R
S
3.0, 2.5, 1.8, 1.5,
1.2
25-
series OCT
with calibration
VCCIO = 3.0, 2.5,
1.8, 1.5, 1.2
± 10
%
相关PDF资料
PDF描述
AMM08DRES CONN EDGECARD 16POS .156 EYELET
HSC49DRYS-S93 CONN EDGECARD 98POS DIP .100 SLD
GMC65DRXN-S734 CONN EDGECARD 130PS DIP .100 SLD
GMC65DRXH-S734 CONN EDGECARD 130PS DIP .100 SLD
FMC22DRXI-S734 CONN EDGECARD 44POS DIP .100 SLD
相关代理商/技术参数
参数描述
EP2AGX125DF25C5NES 制造商:Altera Corporation 功能描述:IC ARRIA II GX FPGA 572FBGA 制造商:Altera Corporation 功能描述:IC FPGA 260 I/O 572FBGA
EP2AGX125DF25C6 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX125DF25C6N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX125DF25C6NES 制造商:Altera Corporation 功能描述:FPGA Arria
EP2AGX125DF25I3 功能描述:IC ARRIA II GX FPGA 125K 572FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Arria II GX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)