参数资料
型号: EP2AGX125DF25C6N
厂商: Altera
文件页数: 71/90页
文件大小: 0K
描述: IC ARRIA II GX FPGA 125K 572FBGA
产品培训模块: Arria II GX FPGA
Three Reasons to Use FPGA's in Industrial Designs
特色产品: Arria? II GX FPGAs
标准包装: 5
系列: Arria II GX
LAB/CLB数: 4964
逻辑元件/单元数: 118143
RAM 位总计: 8315904
输入/输出数: 260
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 572-FBGA
供应商设备封装: 572-FBGA
其它名称: 544-2595-5
EP2AGX125DF25C6NES
EP2AGX125DF25C6NES-ND
Chapter 1: Device Datasheet for Arria II Devices
1–65
Switching Characteristics
December 2013
Altera Corporation
fHSCLK_OUT (output
clock frequency)
5
717 (7)
5
717 (7)
MHz
Transmitter
fHSDR (true LVDS
output data rate)
SERDES factor, J = 3
to 10
(using dedicated
SERDES) (8)
1250
1250
Mbps
SERDES factor J = 2,
(using DDR registers)
Mbps
SERDES factor J = 1,
(uses an SDR
register)
Mbps
fHSDR (emulated
LVDS_E_3R output
data rate) (5)
SERDES factor J = 4
to 10
1152
800
Mbps
fHSDR (emulated
LVDS_E_1R output
data rate)
—200
200
Mbps
tx Jitter
Total jitter for data
rate, 600 Mbps to
1.6 Gbps
160—
—160
ps
Total jitter for data
rate, < 600 Mbps
0.1—
—0.1
UI
tx Jitter - emulated
differential I/O
standards with three
external output resistor
network
Total jitter for data
rate, 600 Mbps to
1.25 Gbps
300—
—325
ps
Total jitter for data
rate < 600 Mbps
0.2
0.25
UI
tx Jitter - emulated
differential I/O
standards with one
external output resistor
network
—0.15—
—0.15
UI
tDUTY
TX output clock duty
cycle for both True
and emulated
differential I/O
standards
45
50
55
45
50
55
%
Table 1–54. High-Speed I/O Specifications for Arria II GZ Devices (Note 1), (2), (10) (Part 2 of 3)
Symbol
Conditions
C3, I3
C4, I4
Unit
Min
Typ
Max
Min
Typ
Max
相关PDF资料
PDF描述
ACC35DRYS CONN EDGECARD 70POS .100 DIP SLD
B82422A1104K100 INDUCTOR 100UH 65MA 1210 10%
TAJD158M002RNJ CAP TANT 1500UF 2.5V 20% 2917
VJ1206A180KBEAT4X CAP CER 18PF 500V 10% NP0 1206
5173278-4 CONN D-CAP MALE PINS 60POS R/A
相关代理商/技术参数
参数描述
EP2AGX125DF25C6NES 制造商:Altera Corporation 功能描述:FPGA Arria
EP2AGX125DF25I3 功能描述:IC ARRIA II GX FPGA 125K 572FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Arria II GX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
EP2AGX125DF25I3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX125DF25I5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX125DF25I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 4964 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256