参数资料
型号: EP2AGX260FF35C6N
厂商: Altera
文件页数: 66/90页
文件大小: 0K
描述: IC ARRIA II GX 260K 1152FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 3
系列: Arria II GX
LAB/CLB数: 10260
逻辑元件/单元数: 244188
RAM 位总计: 12038144
输入/输出数: 612
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 1152-BBGA
供应商设备封装: 1152-FBGA(27x27)
Chapter 1: Device Datasheet for Arria II Devices
1–61
Switching Characteristics
December 2013
Altera Corporation
Periphery Performance
This section describes periphery performance, including high-speed I/O, external
memory interface, and IOE programmable delay.
I/O performance supports several system interfaces, for example the high-speed I/O
interface, external memory interface, and the PCI/PCI-X bus interface. I/O using
SSTL-18 Class I termination standard can achieve up to the stated DDR2 SDRAM
interfacing speed with typical DDR2 SDRAM memory interface setup. I/O using
general purpose I/O (GPIO) standards such as 3.0, 2.5, 1.8, or 1.5 LVTTL/LVCMOS
are capable of typical 200 MHz interfacing frequency with 10pF load.
1 Actual achievable frequency depends on design- and system-specific factors. You
should perform HSPICE/IBIS simulations based on your specific design and system
setup to determine the maximum achievable frequency in your system.
High-Speed I/O Specification
Table 1–53 lists the high-speed I/O timing for Arria II GX devices.
Table 1–53. High-Speed I/O Specifications for Arria II GX Devices (Part 1 of 4)
Symbol
Conditions
I3
C4
C5,I5
C6
Unit
Min
Max
Min
Max
Min
Max
Min
Max
Clock
fHSCLK_IN
(input clock
frequency)–Row
I/O
Clock boost
factor, W =
1 to 40 (1)
5
670
5
670
5
622
5
500
MHz
fHSCLK_IN
(input clock
frequency)–
Column I/O
Clock boost
factor, W =
1 to 40 (1)
5
500
5
500
5
472.5
5
472.5
MHz
fHSCLK_OUT
(output clock
frequency)–Row
I/O
5
670
5
670
5
622
5
500
MHz
fHSCLK_OUT
(output clock
frequency)–
Column I/O
5
500
5
500
5
472.5
5
472.5
MHz
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EP2AGX260FF35C6NES 制造商:Altera Corporation 功能描述:IC FPGA 612 I/O 1152FBGA 制造商:Altera Corporation 功能描述:IC ARRIA II GX FPGA 1152FBGA
EP2AGX260FF35I3 功能描述:IC ARRIA II GX 260K 1152FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Arria II GX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
EP2AGX260FF35I3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35I5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256