参数资料
型号: EP2AGX260FF35C6N
厂商: Altera
文件页数: 79/90页
文件大小: 0K
描述: IC ARRIA II GX 260K 1152FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 3
系列: Arria II GX
LAB/CLB数: 10260
逻辑元件/单元数: 244188
RAM 位总计: 12038144
输入/输出数: 612
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 1152-BBGA
供应商设备封装: 1152-FBGA(27x27)
1–72
Chapter 1: Device Datasheet for Arria II Devices
Switching Characteristics
December 2013
Altera Corporation
IOE Programmable Delay
Table 1–66 lists the delay associated with each supported IOE programmable delay
chain for Arria II GX devices.
Table 1–67 lists the IOE programmable delay settings for Arria II GZ devices.
Table 1–66. IOE Programmable Delay for Arria II GX Devices
Parameter
Available
Settings
Minimum
Offset
Maximum Offset
Unit
Fast Model
Slow Model
I3
C4
I5
I3
C4
C5
I5
C6
Output
enable pin
delay
7
0
0.413
0.442
0.413
0.814
0.713
0.796
0.801
0.873
ns
Delay from
output
register to
output pin
7
0
0.339
0.362
0.339
0.671
0.585
0.654
0.661
0.722
ns
Input delay
from pin to
internal cell
52
0
1.494
1.607
1.494
2.895
2.520
2.733
2.775
2.944
ns
Input delay
from pin to
input register
52
0
1.493
1.607
1.493
2.896
2.503
2.732
2.774
2.944
ns
DQS bus to
input register
delay
4
0
0.074
0.076
0.074
0.140
0.124
0.147
0.167
ns
Notes to Table 1–66:
(1) The available setting for every delay chain starts with zero and ends with the specified maximum number of settings.
(2) The minimum offset represented in the table does not include intrinsic delay.
Table 1–67. IOE Programmable Delay for Arria II GZ Devices
Parameter
Available
Settings
Minimum
Offset (2)
Maximum Offset
Unit
Fast Model
Slow Model
Industrial
Commercial
C3
I3
C4
I4
D1
15
0
0.462
0.505
0.795
0.801
0.857
0.864
ns
D2
7
0
0.234
0.232
0.372
0.371
0.407
0.405
ns
D3
7
0
1.700
1.769
2.927
2.948
3.157
3.178
ns
D4
15
0
0.508
0.554
0.882
0.889
0.952
0.959
ns
D5
15
0
0.472
0.500
0.799
0.817
0.875
0.882
ns
D6
6
0
0.186
0.195
0.319
0.321
0.345
0.347
ns
Notes to Table 1–67:
(1) You can set this value in the Quartus II software by selecting D1, D2, D3, D4, D5, and D6 in the Assignment Name column.
(2) Minimum offset does not include the intrinsic delay.
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EP2AGX260FF35C6NES 制造商:Altera Corporation 功能描述:IC FPGA 612 I/O 1152FBGA 制造商:Altera Corporation 功能描述:IC ARRIA II GX FPGA 1152FBGA
EP2AGX260FF35I3 功能描述:IC ARRIA II GX 260K 1152FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Arria II GX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
EP2AGX260FF35I3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35I5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256