参数资料
| 型号： | EP7309-CV |
| 厂商： | Cirrus Logic Inc |
| 文件页数： | 5/42页 |
| 文件大小： | 0K |
| 描述： | IC ARM720T MCU 74MHZ 208-LQFP |
| 标准包装： | 36 |
| 系列： | EP7 |
| 核心处理器： | ARM7 |
| 芯体尺寸： | 32-位 |
| 速度： | 74MHz |
| 连通性： | 编解码器，DAI，EBI/EMI，IrDA，键盘，SPI/Microwire1，UART/USART |
| 外围设备： | LCD，LED，MaverickKey，POR，PWM |
| 输入/输出数： | 27 |
| 程序存储器类型： | ROMless |
| RAM 容量： | 56K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 2.3 V ~ 2.7 V |
| 振荡器型： | 外部 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 208-LQFP |
| 包装： | 托盘 |
| 其它名称： | 598-1213 |
第1页第2页第3页第4页当前第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页
DS507F2
Copyright Cirrus Logic, Inc. 2011
(All Rights Reserved)
13
EP7309
High-Performance, Low-Power System on Chip
Note:
1) Total power consumption = IDDCORE x 2.5 V + IDDIO x 3.3 V
2) A typical design will provide 3.3 V to the I/O supply (i.e., VDDIO), and 2.5 V to the remaining logic. This is to allow the I/O to be
compatible with 3.3 V powered external logic (i.e., 3.3 V SDRAMs).
2) Pull-up current = 50 A typical at VDD = 3.3 V.
CI/O
Transceiver capacitance
8
-
10.0
pF
IDD
STANDBY
@ 25 C
Standby current consumption1
Core, Osc, RTC @2.5 V
I/O @ 3.3 V
-
77
41
-
A
Only nPOR, nPWRFAIL,
nURESET, PE0, PE1, and RTS
are driven, while all other float,
VIH = VDD ± 0.1 V,
VIL = GND ± 0.1 V
IDD
STANDBY
@ 70 C
Standby current consumption1
Core, Osc, RTC @2.5 V
I/O @ 3.3 V
-
570
111
A
Only nPOR, nPWRFAIL,
nURESET, PE0, PE1, and RTS
are driven, while all other float,
VIH = VDD ± 0.1 V,
VIL = GND ± 0.1 V
IDD
STANDBY
@ 85 C
Standby current consumption1
Core, Osc, RTC @2.5 V
I/O @ 3.3 V
-
1693
163
A
Only nPOR, nPWRFAIL,
nURESET, PE0, PE1, and RTS
are driven, while all other float,
VIH = VDD ± 0.1 V,
VIL = GND ± 0.1 V
IDDidle
at 74 MHz
Idle current consumption1
Core, Osc, RTC @2.5 V
I/O @ 3.3 V
-
6
10
-
mA
Both oscillators running, CPU
static, Cache enabled, LCD
disabled, VIH = VDD ± 0.1 V, VIL
= GND ± 0.1 V
VDD
STANDBY
Standby supply voltage
2.0
-
V
Minimum standby voltage for
state retention, internal SRAM
cache, and RTC operation only
a.
Refer to the strength column in the pin assignment tables for all package types.
b.
Assumes buffer has no pull-up or pull-down resistors.
c.
The leakage value given assumes that the pin is configured as an input pin but is not currently being driven.
Symbol
Parameter
Min
Typ
Max
Unit
Conditions
相关PDF资料 |
PDF描述 |
|---|---|
| EP7311-IV-90 | IC ARM720T MCU 90MHZ 208-LQFP |
| EP7312-IV-90 | IC ARM720T MCU 90MHZ 208-LQFP |
| EP9301-CQZ | IC ARM9 SOC PROCESSOR 208LQFP |
| EP9301-IQ | IC ARM920T MCU 166MHZ 208-LQFP |
| EP9307-IR | IC ARM920T MCU 200MHZ 272-TFBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| EP7309-CV-C | 制造商:CIRRUS 制造商全称:Cirrus Logic 功能描述:HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE |
| EP7309-CVZ | 功能描述:音频片上系统 - SoC IC Ultra Low Power Audio Decode SOC RoHS:否 制造商:Cirrus Logic |
| EP7309-EB-C | 制造商:CIRRUS 制造商全称:Cirrus Logic 功能描述:HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE |
| EP7309-ER-C | 制造商:CIRRUS 制造商全称:Cirrus Logic 功能描述:HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE |
| EP7309-EV-C | 制造商:CIRRUS 制造商全称:Cirrus Logic 功能描述:HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE |
发布紧急采购，3分钟左右您将得到回复。