参数资料
型号: EPF10K130E
厂商: Altera Corporation
英文描述: Embedded Programmable Logic Family(FLEX10KE嵌入式可编程逻辑系列)
中文描述: 嵌入式可编程逻辑系列(FLEX10KE嵌入式可编程逻辑系列)
文件页数: 3/121页
文件大小: 2001K
代理商: EPF10K130E
Altera Corporation
3
Preliminary Information
FLEX 10KE Embedded Programmable Logic Family Data Sheet
I
Software design support and automatic place-and-route provided by
Altera’s MAX+PLUS
II development system for Windows-based
PCs and Sun SPARCstation, HP 9000 Series 700/800, and IBM RISC
System/6000 workstations, and the Quartus
TM
development system
for Windows-based PCs and Sun SPARCstation and
HP 9000 Series 700 workstations
Flexible package options
Available in a variety of packages with 144 to 672 pins, including
the innovative FineLine BGA
TM
packages (see
Tables 3
and
4
)
SameFrame
TM
pin compatibility with FLEX 10KA and
FLEX 10KE devices across a range of device densities and pin
counts
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
DesignWare components, Verilog HDL, VHDL, and other interfaces
to popular EDA tools from manufacturers such as Cadence,
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,
VeriBest, and Viewlogic
I
I
Notes:
(1)
(2)
Contact Altera Customer Marketing for up-to-date information on package availability.
FLEX 10KE device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), pin-grid array
(PGA), and ball-grid array (BGA) packages.
Devices in the same package are pin-compatible, although some devices have more I/O pins than others. When
planning device migration, use the I/O pins that are common to all devices. The MAX+PLUS II software
versions 9.1 and higher provide features to help designers use only the common pins.
This option will be supported with a 484-pin FineLine BGA package. By using SameFrame pin migration, all
FineLine BGA packages are pin-compatible. For example, a board can be designed to support 256-pin, 484-pin, and
672-pin FineLine BGA packages. The Quartus and MAX+PLUS II software automatically avoids conflicting pins
when future migration is set.
(3)
(4)
Table 3. FLEX 10KE Package Options & I/O Pin Count
Notes (1)
,
(2)
,
(3)
Device
144-Pin
TQFP
208-Pin
PQFP
240-Pin
PQFP
RQFP
256-Pin
FineLine
BGA
356-Pin
BGA
484-Pin
FineLine
BGA
599-Pin
PGA
600-Pin
BGA
672-Pin
FineLine
BGA
EPF10K30E
EPF10K50E
EPF10K50S
EPF10K100B
EPF10K100E
EPF10K130E
EPF10K200E
EPF10K200S
102
102
102
147
147
147
147
147
176
191
191
191
191
220
254
254
220
254
254
(4)
(4)
(4)
189
189
189
189
186
220
220
274
274
338
369
338
413
470
470
(4)
424
470
470
470
470
182
274
369
相关PDF资料
PDF描述
EPF10K200S Embedded Programmable Logic Family(FLEX10KE嵌入式可编程逻辑系列)
EPF10K40 Embedded Programmable Logic Family(FLEX10K嵌入式可编程逻辑系列)
EPF10K50E Embedded Programmable Logic Family(FLEX10KE嵌入式可编程逻辑系列)
EPF10K50V Embedded Programmable Logic Family(FLEX10K嵌入式可编程逻辑系列)
EPF6010A Programmable Logic Device Family(FLEX6000可编程逻辑系列器件)
相关代理商/技术参数
参数描述
EPF10K130EBC356-1 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EBC356-1X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EBC356-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EBC356-2X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K130EBC356-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 832 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256