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参数资料
| 型号： | EPF10K200S |
| 厂商： | Altera Corporation |
| 英文描述： | Embedded Programmable Logic Family(FLEX10KE嵌入式可编程逻辑系列) |
| 中文描述： | 嵌入式可编程逻辑系列（FLEX10KE嵌入式可编程逻辑系列） |
| 文件页数： | 4/20页 |
| 文件大小： | 322K |
| 代理商： | EPF10K200S |
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Altera Corporation
PIB 21: Implementing Logic with the Embedded Array in FLEX 10K Devices
Embedded vs.
Distributed
RAM
The FLEX 10K embedded RAM implements logic functions more
efficiently than distributed RAM. Distributed RAM, as used in field-
programmable gate arrays (FPGAs), allows the designer to use a
particular array of memory cells either as part of the general logic array or
as addressable RAM. However, using distributed RAM provides only
small RAM blocks such as 16
×
2 or 32
applications larger than 32
×
1 results in lower performance and lower
device utilization. To create larger RAM blocks, the small RAM blocks
must be interconnected using additional logic cells. However, adding
logic cells can cause less predictable delays, routing problems, and can
reduce the amount of available logic for implementing other functions.
Therefore, there is no advantage gained from implementing logic
functions with distributed RAM than with logic cells.
×
1. Using distributed RAM for
In contrast, FLEX 10K devices dedicate a portion of the device to
embedded RAM. Embedded RAM is implemented in the EAB, which is a
large block of flexible RAM. Altera’s MAX+PLUS II development
software automatically cascades EABs to implement blocks of RAM larger
than 2,048
×
1. Because the EAB is inherently a large RAM block, the EAB
can implement complex logic functions in a single logic level, so
additional logic cells are not required. FLEX 10K devices can offer as
much as 24 Kbits of RAM without sacrificing logic capacity. Therefore,
implementing logic functions with embedded RAM in FLEX 10K EABs
results in higher resource utilization and predictable performance.
Manufacturers of distributed-RAM FPGAs claim that embedding large
blocks of RAM into a programmable device is inefficient because die area
is wasted if a design does not use RAM. However, EABs that are not used
as memory will be used as logic, and most designs will contain some
complex logic functions that can be implemented by EABs.
Applications
EABs can be used for a variety of specialized logic applications, including:
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Symmetric multiplier
Asymmetric multiplier
Constant multiplier/vector scalar
Digital filter
Two-dimensional convolver
State machine
Transcendental functions
Waveform generator
8 bit-to-10 bit encoder
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EPF10K200SBC356-1 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K200SBC356-1X | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K200SBC356-2 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K200SBC356-2X | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K200SBC356-3 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 1248 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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