参数资料
型号: EPF10K30EFC256-2
英文描述: Field Programmable Gate Array (FPGA)
中文描述: 现场可编程门阵列(FPGA)
文件页数: 63/120页
文件大小: 1901K
代理商: EPF10K30EFC256-2
Altera Corporation
47
FLEX 10KE Embedded Programmable Logic Family Data Sheet
Generic Testing
Each FLEX 10KE device is functionally tested. Complete testing of each
configurable static random access memory (SRAM) bit and all logic
functionality ensures 100% yield. AC test measurements for FLEX 10KE
devices are made under conditions equivalent to those shown in
Figure 21. Multiple test patterns can be used to configure devices during
all stages of the production flow.
Figure 21. FLEX 10KE AC Test Conditions
Operating
Conditions
Tables 19 through 23 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 2.5-V FLEX 10KE devices.
Test
System
C1 (includes
JIG capacitance)
Device input
rise and fall
times < 3 ns
Device
Output
703
8.06 k
[481
]
[481
]
VCCIO
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests
must not be performed under AC
conditions. Large-amplitude, fast-
ground-current transients normally
occur as the device outputs discharge
the load capacitances. When these
transients ow through the parasitic
inductance between the device ground
pin and the test system ground,
signicant reductions in observable
noise immunity can result. Numbers in
brackets are for 2.5-V devices or outputs.
Numbers without brackets are for 3.3-V
Table 19. FLEX 10KE 2.5-V Device Absolute Maximum Ratings
Symbol
Parameter
Conditions
Min
Max
Unit
VCCINT
Supply voltage
With respect to ground (2)
–0.5
3.6
V
VCCIO
–0.5
4.6
V
VI
DC input voltage
–2.0
5.75
V
IOUT
DC output current, per pin
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
° C
TAMB
Ambient temperature
Under bias
–65
135
° C
TJ
Junction temperature
PQFP, TQFP, BGA and FineLine BGA
packages, under bias
135
° C
Ceramic PGA packages, under bias
150
° C
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相关代理商/技术参数
参数描述
EPF10K30EFC256-2DX 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC
EPF10K30EFC256-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 176 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30EFC256-2X 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 176 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30EFC256-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 176 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30EFC256-3DX 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC