参数资料
型号: EPM7032BTI44-5
厂商: Altera
文件页数: 6/66页
文件大小: 0K
描述: IC MAX 7000 CPLD 32 44-TQFP
标准包装: 480
系列: MAX® 7000B
可编程类型: 系统内可编程
最大延迟时间 tpd(1): 5.0ns
电压电源 - 内部: 2.375 V ~ 2.625 V
逻辑元件/逻辑块数目: 2
宏单元数: 32
门数: 600
输入/输出数: 36
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 44-TQFP
供应商设备封装: 44-TQFP(10x10)
包装: 托盘
14
Altera Corporation
MAX 7000B Programmable Logic Device Data Sheet
SameFrame
Pin-Outs
MAX 7000B devices support the SameFrame pin-out feature for
FineLine BGA and 0.8-mm Ultra FineLine BGA packages. The
SameFrame pin-out feature is the arrangement of balls on FineLine BGA
and 0.8-mm Ultra FineLine BGA packages such that the lower-ball-count
packages form a subset of the higher-ball-count packages. SameFrame
pin-outs provide the flexibility to migrate not only from device to device
within the same package, but also from one package to another. FineLine
BGA packages are compatible with other FineLine BGA packages, and
0.8-mm Ultra FineLine BGA packages are compatible with other 0.8-mm
Ultra FineLine BGA packages. A given printed circuit board (PCB) layout
can support multiple device density/package combinations. For example,
a single board layout can support a range of devices from an EPM7064B
device in a 100-pin FineLine BGA package to an EPM7512B device in a
256-pin FineLine BGA package.
The Altera software provides support to design PCBs with SameFrame
pin-out devices. Devices can be defined for present and future use. The
Altera software generates pin-outs describing how to layout a board to
take advantage of this migration (see Figure 7).
Figure 7. SameFrame Pin-Out Example
Designed for 256-Pin FineLine BGA Package
Printed Circuit Board
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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