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| 型号： | EVAL-ADUM3471EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 28/36页 |
| 文件大小： | 0K |
| 描述： | EVALUATION MODULE FOR ADUM3471 |
| 标准包装： | 1 |
| 系列： | iCoupler® |
| 主要目的： | 接口，数字式隔离器 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | ADuM3470，ADuM3471，ADuM3472，ADuM3473，ADuM3474 |
| 主要属性： | 2 个独立的 ADuM347x 电路 |
| 次要属性： | 3.3 V ~ 5.5 V 电源 |
| 已供物品： | 板 |
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ADuM3470/ADuM3471/ADuM3472/ADuM3473/ADuM3474
Data Sheet
Inductors must be selected based on the value and supply
current needed. Most applications with switching frequencies
between 500 kHz and 1 MHz and load transients between 10%
and 90% of full load are stable with the 47 μH inductor value
listed in Table 19. Values as large as 200 μH can be used for power
supply applications with a switching frequency as low as 200 kHz
to help stabilize the output voltage or for improved load transient
response (see Figure 30 to Figure 33). Inductors in a small 1212
or 1210 size are listed in Table 19 with a 47 μH value and a 0.41 A
current rating to handle the majority of applications below a
400 mA load, and with a 100 μH value and a 0.34 A current
rating to handle a load up to 300 mA.
Recommended Schottky diodes have low forward voltage to
reduce losses and high reverse voltage of up to 40 V to withstand
the peak voltages available in the doubling circuits shown in
PRINTED CIRCUIT BOARD (PCB) LAYOUT
of the low ESR capacitor and the V DDx and GND x pins must not
exceed 2 mm. Installing a bypass capacitor with traces more
than 2 mm in length can result in data corruption.
The board layout in Figure 41 shows enlarged pads for Pin 2
and Pin 10 (GND 1 ) on Side 1 and Pin 11 and Pin 19 (GND 2 )
on Side 2. Large diameter vias should be implemented from the
pad to the ground planes and power planes to increase thermal
conductivity and to reduce inductance. Multiple vias in the
thermal pads can significantly reduce temperatures inside the
chip. The dimensions of the expanded pads are left to the discre-
tion of the designer and depend on the available board space.
THERMAL ANALYSIS
The ADuM347x parts consist of two internal die attached to a
split lead frame with two die attach paddles. For the purposes
of thermal analysis, the die are treated as a thermal unit, with
the highest junction temperature reflected in the θ JA value from
the parts mounted on a JEDEC standard, 4-layer board with
fine width traces and still air.
Under normal operating conditions, the ADuM347x devices
operate at full load across the full temperature range without
derating the output current. However, following the recom-
mendations in the Printed Circuit Board (PCB) Layout section
decreases thermal resistance to the PCB, allowing increased
thermal margins at high ambient temperatures.
X1
GND 1
NC
X2
V IA /V OA
V IB /V OB
V IC /V OC
V ID /V OD
V DDA
GND 1
Figure 41. Recommended PCB Layout
V REG
GND 2
V DD2
FB
V IA /V OA
V IB /V OB
V IC /V OC
V ID /V OD
OC
GND 2
The ADuM347x devices have a thermal shutdown circuit
that shuts down the dc-to-dc converter and the outputs of the
ADuM347x when a die temperature of approximately 160°C
is reached. When the die cools below approximately 140°C, the
ADuM347x dc-to-dc converter and outputs turn on again.
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the length of
time it takes for a logic signal to propagate through a compo-
nent (see Figure 42). The propagation delay to a logic low output
can differ from the propagation delay to a logic high output.
In applications that involve high common-mode transients, ensure
that board coupling across the isolation barrier is minimized.
Furthermore, design the board layout such that any coupling that
does occur affects all pins equally on a given component side.
Failure to ensure this can cause voltage differentials between pins
INPUT (V Ix )
OUTPUT (V Ox )
t PLH
t PHL
50%
50%
thereby leading to latch-up and/or permanent damage.
ADuM3474 are power devices that dissipate approximately 1 W
of power when fully loaded and running at maximum speed.
Because it is not possible to apply a heat sink to an isolation device,
the devices primarily depend on heat dissipation into the PCB
through the GND x pins. If the devices are used at high ambient
temperatures, provide a thermal path from the GND x pins to the
PCB ground plane.
Figure 42. Propagation Delay Parameters
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of how
accurately the timing of the input signal is preserved.
Channel-to-channel matching refers to the maximum amount
that the propagation delay differs between channels within a
single ADuM347x component.
Propagation delay skew refers to the maximum amount that the
propagation delay differs between multiple ADuM347x compo-
nents operating under the same conditions.
Rev. A | Page 28 of 36
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