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参数资料
| 型号： | FAN8060EMPX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 3/13页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 1A 10MLP |
| 标准包装： | 1 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 1.2 V ~ 5.5 V |
| 输入电压： | 2.5 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 1.21MHz |
| 电流 - 输出： | 1A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-WFDFN 裸露焊盘 |
| 包装： | 标准包装 |
| 供应商设备封装： | 10-MLP |
| 其它名称： | FAN8060EMPXDKR |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only. All voltage values, except differential voltages, are
given with respect to the network ground terminal. Stress beyond those listed under Absolute Maximum Ratings may
cause permanent damage to the device.
Symbols
V PVIN
V AVIN
V SW
T STG
T J
Parameter
PVIN (AGND=PGND)
AVIN (AGND=PGND)
Switch Voltage, SW to GND
All other pins except COMP
Storage Temperature
Junction Temperature
Min.
-0.3
-0.3
-0.3
-0.3
-65
-40
Max.
6.0
6.0
V IN + 0.3 or 6.0
6.0
+150
+125
Unit
V
V
V
V
°C
°C
ESD
Electrostatic Discharge Protection
Human Body Model,
JESD22-A114
Charged Device Model,
JESD22-C101
2.0
2.5
kV
Note:
2.
COMP pin has an internal clamp to 1.5 V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
V IN
T A
Parameter
Supply Voltage
Ambient Operating Temperature
Min.
2.5
-40
Max.
5.5
+85
Unit
V
°C
Thermal Information
Symbol
T STG
Storage Temperature
Parameter
Min.
-65
Typ.
Max.
+150
Units
°C
T L
θ JA
Lead Soldering Temperature, 30 Seconds
Thermal Resistance: Junction-to-Ambient
49
+300
°C
°C/W
θ Jc
Thermal Resistance: Junction-to-Case
8
°C/W
Total Power Dissipation in the package, T A =25°C
P D
1.3
W
Note:
3.
Typical thermal resistance when mounted on a four-layer PCB. Actual results are dependent upon mounting
method and surface related to the design.
? 2013 Fairchild Semiconductor Corporation
FAN8060 ? Rev. 1.0.1
3
www.fairchildsemi.com
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