参数资料
型号: FDC637BNZ
厂商: Fairchild Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: MOSFET N-CH 20V 6.2A 6-SSOT
产品变化通告: Mold Compound Change 08/April/2008
产品目录绘图: MOSFET SuperSOT-6
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 6.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 24 毫欧 @ 6.2A,4.5V
Id 时的 Vgs(th)(最大): 1.5V @ 250µA
闸电荷(Qg) @ Vgs: 12nC @ 4.5V
输入电容 (Ciss) @ Vds: 895pF @ 10V
功率 - 最大: 800mW
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: 6-SSOT
包装: 标准包装
产品目录页面: 1602 (CN2011-ZH PDF)
其它名称: FDC637BNZDKR
September 2007
N-Channel 2.5V Specified PowerTrench MOSFET
F DC637BNZ
20V, 6.2A, 24m ?
?
tm
Features
Max r DS(on) = 24m ? at V GS = 4.5V, I D = 6.2A
Max r DS(on) = 32m ? at V GS = 2.5V, I D = 5.2A
Fast switching speed
Low gate charge (8nC typical)
High performance trench technology for extremely low r DS(on)
SuperSOT?–6 package: small footprint (72% smaller than
standard SO-8; low profile (1mm thick)
HBM ESD protection level > 2kV typical (Note 3)
Manufactured using green packaging material
Halide-Free
RoHS Compliant
S
General Description
This N-Channel 2.5V specified MOSFET is produced using
Fairchild Semiconductor ’s advanced PowerTrench ? process
that has been especially tailored to minimize the on-state
resistance and yet maintain low gate charge for superior
switching performance.
These devices have been designed to offer exceptional power
dissipation in a very small footprint compared with bigger SO-8
and TSSOP-8 packages.
Applications
DC - DC Conversion
Load switch
Battery Protection
D
D
G
D
D
1
2
6
5
D
D
Pin 1
D
D
G
3
4
S
SuperSOT TM -6
MOSFET Maximum Ratings T A = 25°C unless otherwise noted
Symbol
V DS
V GS
Drain to Source Voltage
Gate to Source Voltage
Parameter
Ratings
20
±12
Units
V
V
I D
Drain Current
-Continuous
-Pulsed
T A = 25°C
(Note 1a)
6.2
20
A
P D
Power Dissipation
Power Dissipation
T A = 25°C
T A = 25°C
(Note 1a)
(Note 1b)
1.6
0.8
W
T J , T STG
Operating and Storage Junction Temperature Range
–55 to +150
° C
Thermal Characteristics
R θ JA
R θ JA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1a)
(Note 1b)
78
156
°C/W
Package Marking and Ordering Information
Device Marking
.637Z
Device
FDC637BNZ
Package
SSOT6
Reel Size
7’’
Tape Width
8mm
Quantity
3000 units
?2007 Fairchild Semiconductor Corporation
FDC637BNZ Rev.C
1
www.fairchildsemi.com
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相关代理商/技术参数
参数描述
FDC638 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:P-Channel 2.5V Specified PowerTrenchTM MOSFET
FDC638APZ 功能描述:MOSFET -20V P-Channel 2.5V PowerTrench MOSFET RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
FDC638H 制造商:Fairchild Semiconductor Corporation 功能描述: 制造商:Freescale Semiconductor 功能描述:
FDC638P 功能描述:MOSFET SSOT-6 P-CH -20V RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
FDC638P 制造商:Fairchild Semiconductor Corporation 功能描述:MOSFET P SUPERSOT-6