参数资料
型号: FDC645N_F095
厂商: Fairchild Semiconductor
文件页数: 4/5页
文件大小: 0K
描述: MOSFET N-CH 30V 5.5A 6-SSOT
产品变化通告: Mold Compound Change 08/April/2008
标准包装: 3,000
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 5.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 26 毫欧 @ 6.2A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 21nC @ 4.5V
输入电容 (Ciss) @ Vds: 1460pF @ 15V
功率 - 最大: 800mW
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: 6-SSOT
包装: 带卷 (TR)
Typical Characteristics
10
2400
8
I D = 5.5A
V DS = 5V
10V
2000
f = 1MHz
V GS = 0 V
15
6
V
1600
C ISS
1200
4
800
2
400
C OSS
C RSS
0
0
0
5
10
15
20
25
30
0
5
10
15
20
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
100
5
V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
10
R DS(ON) LIMIT
10ms
1ms
100 μ s
4
SINGLE PULSE
R θ JA = 156°C/W
T A = 25°C
100ms
1s
3
1
10s
V GS = 4.5V
DC
2
0.1
0.01
SINGLE PULSE
R θ JA = 156 o C/W
T A = 25 o C
1
0
0.1
1
10
100
0.1
1
10
100
1000
V DS , DRAIN-SOURCE VOLTAGE (V)
Figure 9. Maximum Safe Operating Area.
t 1 , TIME (sec)
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
0.2
R θ JA (t) = r(t) + R θ JA
0.1
0.1
R θ JA = 156°C/W
0.01
0.05
0.02
0.01
SINGLE PULSE
P(pk)
t 1
t 2
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 / t 2
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t 1 , TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b.
Transient thermal response will change depending on the circuit board design.
FDC645N Rev C(W)
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