参数资料
| 型号： | FDMF6707C |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 15/18页 |
| 文件大小： | 0K |
| 描述： | MODULE DRMOS 50A 40-PQFN |
| 标准包装： | 3,000 |
| 系列： | XS™ DrMOS |
| 类型： | 高端/低端驱动器 |
| 输入类型： | PWM |
| 输出数： | 1 |
| 电流 - 输出 / 通道： | 50A |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-PowerTFQFN |
| 供应商设备封装： | 40-PQFN（6x6） |
| 包装： | 带卷 (TR) |
PCB Layout Guidelines
Figure 29 provides an example of a proper layout for the
FDMF6707C and critical components. All of the high-
current paths, such as V IN , V SWH , V OUT , and GND
copper, should be short and wide for low inductance
and resistance. This technique achieves a more stable
and evenly distributed current flow, along with enhanced
heat radiation and system performance.
The following guidelines are recommendations for the
PCB designer:
1. Input ceramic bypass capacitors must be placed
close to the VIN and PGND pins. This helps reduce
the high-current power loop inductance and the input
current ripple induced by the power MOSFET
switching operation.
2. The V SWH copper trace serves two purposes. In
addition to being the high-frequency current path
from the DrMOS package to the output inductor, it
also serves as a heat sink for the low-side MOSFET
in the DrMOS package. The trace should be short
and wide enough to present a low-impedance path
for the high-frequency, high-current flow between the
DrMOS and inductor to minimize losses and
temperature rise. Note that the VSWH node is a
high-voltage and high-frequency switching node with
high noise potential. Care should be taken to
minimize coupling to adjacent traces. Since this
copper trace also acts as a heat sink for the lower
FET, balance using the largest area possible to
improve DrMOS cooling while maintaining
acceptable noise emission.
3. An output inductor should be located close to the
FDMF6707C to minimize the power loss due to the
VSWH copper trace. Care should also be taken so
the inductor dissipation does not heat the DrMOS.
4. PowerTrench ? MOSFETs are used in the output
stage. The power MOSFETs are effective at
minimizing ringing due to fast switching. In most
cases, no VSWH snubber is required. If a snubber is
used, it should be placed close to the VSWH and
PGND pins. The resistor and capacitor need to be of
proper size for the power dissipation.
5. VCIN, VDRV, and BOOT capacitors should be
placed as close as possible to the VCIN to CGND,
VDRV to CGND, and BOOT to PHASE pins to
ensure clean and stable power. Routing width and
length should be considered.
6. Include a trace from PHASE to VSWH to improve
noise margin. Keep the trace as short as possible.
7. The layout should include a placeholder to insert a
small-value series boot resistor (R BOOT ) between the
? 2011 Fairchild Semiconductor Corporation
FDMF6707C ? Rev. 1.0.2
15
boot capacitor (C BOOT ) and DrMOS BOOT pin. The
BOOT-to-VSWH loop size, including R BOOT and
C BOOT , should be as small as possible. The boot
resistor may be required when operating near the
maximum rated V IN . The boot resistor is effective at
controlling the high-side MOSFET turn-on slew rate
and VSHW overshoot. R BOOT can improve noise
operating margin in synchronous buck designs that
may have noise issues due to ground bounce or high
positive and negative VSWH ringing. However,
inserting a boot resistance lowers the DrMOS
efficiency. Efficiency versus noise trade-offs must be
considered. R BOOT values from 0.5 ? to 2.0 ? are
typically effective in reducing VSWH overshoot.
The VIN and PGND pins handle large current
transients with frequency components greater than
100 MHz. If possible, these pins should be
connected directly to the VIN and board GND
planes. The use of thermal relief traces in series with
these pins is discouraged since this adds
inductance to the power path. Added inductance in
series with the VIN or PGND pin degrades system
noise immunity by increasing positive and negative
VSWH ringing.
8. CGND pad and PGND pins should be connected to
the GND plane copper with multiple vias for stable
grounding. Poor grounding can create a noise
transient offset voltage level between CGND and
PGND. This could lead to faulty operation of the gate
driver and MOSFETs.
9. Ringing at the BOOT pin is most effectively
controlled by close placement of the boot capacitor.
Do not add an additional BOOT to PGND capacitor:
this may lead to excess current flow through the
BOOT diode.
10. The SMOD# and DISB# pins have weak internal
pull-up and pull-down current sources, respectively.
These pins should not have any noise filter
capacitors. Do not to float these pins unless
absolutely necessary.
11. Use multiple vias on each copper area to
interconnect top, inner, and bottom layers to help
distribute current flow and heat conduction. Vias
should be relatively large and of reasonably low
inductance. Critical high-frequency components,
such as R BOOT , C BOOT , the RC snubber, and bypass
capacitors should be located as close to the
respective DrMOS module pins as possible on the
top layer of the PCB. If this is not feasible, they
should be connected from the backside through a
network of low-inductance vias.
www.fairchildsemi.com
相关PDF资料 |
PDF描述 |
|---|---|
| FDMF6707V | MODULE DRMOS 50A 40-PQFN |
| FDMF6708N | MODULE DRMOS 50A 40PQFN |
| FDMF6730 | IC DRIVER FET MULTICHIP 40-MLP |
| FDMF6820A | MODULE DRMOS 60A 40-PQFN |
| FDMF6820B | MODULE DRMOS 55A 40-PQFN |
相关代理商/技术参数 |
参数描述 |
|---|---|
| FDMF6707V | 功能描述:功率驱动器IC Hi Performance, Hi Frequency DrMOS RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FDMF6708N | 功能描述:功率驱动器IC XS DrMOS Module Hi-Perf, Hi-Freq RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FDMF6730 | 功能描述:功率驱动器IC Plus Driver Multichip Modules RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FDMF6820A | 功能描述:功率驱动器IC Xtra Small, Hi Perf, Hi Freq DrMOS Module RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
| FDMF6820B | 功能描述:功率驱动器IC Xtra Small, Hi Perf, Hi Freq DrMOS Module RoHS:否 制造商:Micrel 产品:MOSFET Gate Drivers 类型:Low Cost High or Low Side MOSFET Driver 上升时间: 下降时间: 电源电压-最大:30 V 电源电压-最小:2.75 V 电源电流: 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 封装:Tube |
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