参数资料
型号: FDR836P
厂商: FAIRCHILD SEMICONDUCTOR CORP
元件分类: 小信号晶体管
英文描述: P-Channel 2.5V Specified MOSFET
中文描述: 6100 mA, 20 V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET
封装: SUPERSOT-8
文件页数: 2/8页
文件大小: 224K
代理商: FDR836P
F
FDR836P, Rev. C
Electrical Characteristics
T
A
= 25
°
C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV
DSS
Drain-Source Breakdown Voltage
BV
DSS
T
J
Coefficient
I
DSS
Zero Gate Voltage Drain Current
I
GSSF
Gate-Body Leakage Current, Forward
I
GSSR
Gate-Body Leakage Current, Reverse
V
GS
= 0 V, I
D
= -250
μ
A
I
D
= -250
μ
A, Referenced to 25
°
C
-20
V
Breakdown Voltage Temperature
-24
mV/
°
C
V
DS
= -16 V, V
GS
= 0 V
V
GS
= 8 V, V
DS
= 0 V
V
GS
= -8 V, V
DS
= 0 V
-1
100
-100
μ
A
nA
nA
On Characteristics
(Note 2)
V
GS(th)
Gate Threshold Voltage
V
GS(th)
T
J
Temperature Coefficient
R
DS(on)
Static Drain-Source
On-Resistance
V
DS
= V
GS
, I
D
= -250
μ
A
I
D
= -250
μ
A, Referenced to 25
°
C
-0.4
-0.6
3
-1
V
Gate Threshold Voltage
mV/
°
C
V
GS
= -4.5 V, I
D
= -6.1 A
V
GS
= -4.5V, I
D
=-6.1 A,T
J
=125
°
C
V
GS
= -2.5 V, I
D
= -5 A
V
GS
= -4.5 V, V
DS
= -5 V
V
DS
= -5 V, I
D
= -6.1A
0.022
0.031
0.029
0.030
0.048
0.040
I
D(on)
g
FS
On-State Drain Current
Forward Transconductance
-9
A
S
22
Dynamic Characteristics
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
2200
570
140
pF
pF
pF
V
= -25 V, V
GS
= 0 V,
f = 1.0 MHz
Switching Characteristics
(Note 2)
t
d(on)
Turn-On Delay Time
t
r
Turn-On Rise Time
t
d(off)
Turn-Off Delay Time
t
f
Turn-Off Fall Time
Q
g
Total Gate Charge
Q
gs
Gate-Source Charge
Q
gd
Gate-Drain Charge
10
14
225
85
32
3.2
8.1
18
25
360
135
44
ns
ns
ns
ns
nC
nC
nC
V
DD
= -10 V, I
D
= -1 A,
V
GS
= -4.5 V, R
GEN
= 6
V
DS
= -10 V, I
D
= -6.1 A,
V
GS
= - 4.5 V
Drain-Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain-Source Diode Forward Current
V
SD
Drain-Source Diode Forward Voltage
-1.5
-1.2
A
V
V
GS
= 0 V, I
S
= -1.5 A
(Note 2)
-0.65
Notes:
1.
R
q
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain Pins. R
q
JC
is guaranteed by design while R
q
CA
is determined by the user's board design.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width
300
m
s, Duty Cycle
2.0%
a) 70
°
C/W when mounted on a
1.0 in
2
pad of 2 oz. copper.
b) 125
°
C/W when mounted on a
0.026 in
2
pad of 2oz. copper.
c) 135
°
C/W when mounted on a
minimum pad.
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