参数资料
型号: FDS3590
厂商: Fairchild Semiconductor
文件页数: 2/6页
文件大小: 0K
描述: MOSFET N-CH 80V 6.5A 8SOIC
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 80V
电流 - 连续漏极(Id) @ 25° C: 6.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 39 毫欧 @ 6.5A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 35nC @ 10V
输入电容 (Ciss) @ Vds: 1180pF @ 40V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
其它名称: FDS3590DKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max Units
Drain-Source Avalanche Ratings (Note 2)
W DSS
Single Pulse Drain-Source
V DD = 40 V, I D = 6.5 A
175
mJ
Avalanche Energy
I AR
Maximum Drain-Source
6.5
A
Avalanche Current
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage
V GS = 0 V,
I D = 250 μ A
80
V
? BV DSS
=== ? T J
I DSS
I GSSF
I GSSR
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
I D = 250 μ A, Referenced to 25 ° C
V DS = 64 V, V GS = 0 V
V GS = 20 V, V DS = 0 V
V GS = –20 V, V DS = 0 V
88
1
100
–100
mV/ ° C
μ A
nA
nA
On Characteristics
(Note 2)
V GS(th)n
Gate Threshold Voltage
V DS = V GS ,
I D = 250 μ A
2
4
V
? V GS(th)
=== ? T J
R DS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
I D = 250 μ A, Referenced to 25 ° C
V GS = 10 V, I D = 6.5 A
V GS = 10 V, I D = 6.5 A, T J = 125 ° C
V GS = 6 V,
I D = 4.5 A
–6
32
61
34
39
86
44
mV/ ° C
m ?
I D(on)
On–State Drain Current
V GS = 10 V,
V DS = 5 V
25
A
G FS
Forward Transconductance
V GS = 10 V, I D = 6.5 A
25
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 40 V, V GS = 0 V,
f = 1.0 MHz
1180
171
50
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
V DD = 40 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V DS = 40 V, I D = 6.5 A,
V GS = 10 V
11
8
26
12
25
4.5
5.8
20
16
50
25
35
ns
ns
ns
ns
nC
nC
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Source Diode Forward Current
2.1
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = 2.1 A
(Note 2)
0.74
1.2
V
Voltage
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 50 °C/W when
mounted on a 1in 2
pad of 2 oz copper
b) 105 °C/W when
mounted on a 0.04
in 2 pad of 2 oz
c) 125 °C/W when mounted on a
minimum pad.
copper
FDS3590 Rev C. (W)
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