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参数资料
| 型号： | FEB167 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/15页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR FAN2106 |
| 标准包装： | 1 |
| 系列： | TinyBuck™ |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 1.8V |
| 电流 - 输出： | 6A |
| 输入电压： | 8 ~ 20 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 500kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | FAN2106 |
| 相关产品： | FAN2106EMPXDKR-ND - IC REG BUCK SYNC ADJ 6A 25MLP FAN2106EMPXCT-ND - IC REG BUCK SYNC ADJ 6A 25MLP FAN2106EMPXTR-ND - IC REG BUCK SYNC ADJ 6A 25MLP FAN2106MPXDKR-ND - IC REG BUCK SYNC ADJ 6A 25MLP FAN2106MPXCT-ND - IC REG BUCK SYNC ADJ 6A 25MLP FAN2106MPXTR-ND - IC REG BUCK SYNC ADJ 6A 25MLP |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter
VIN to PGND
VCC to AGND
BOOT to PGND
BOOT to SW
SW to PGND
All other pins
ESD
Conditions
AGND = PGND
Continuous
Transient (t < 20 ns, f < 600 KHz)
Human Body Model, JEDEC JESD22-A114
Charged Device Model, JEDEC JESD22-C101
Min.
-0.3
-0.5
-5.0
-0.3
2.0
2.5
Max.
28
6
35
6.0
24.0
30.0
V CC +0.3
Unit
V
V
V
V
V
V
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
V CC
V IN
T A
Parameter
Bias Voltage
Supply Voltage
Ambient Temperature
Conditions
VCC to AGND
VIN to PGND
FAN2106MPX
FAN2106EMPX
Min.
4.5
3
-10
-40
Typ.
5.0
Max.
5.5
24
+85
+85
Unit
V
V
°C
T J
Junction Temperature
+125
°C
f SW
Switching Frequency
200
600
KHz
Thermal Information
Symbol
T STG
T L
Parameter
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Min.
-65
Typ.
Max.
+150
+300
Unit
°C
°C
P1 (Q2)
4
θ JC
Thermal Resistance: Junction-to-Case
P2 (Q1)
7
°C/W
P3
4
2.8
θ J-PCB
P D
Thermal Resistance: Junction-to-Mounting Surface
Power Dissipation, T A = 25°C
35 (1)
(1)
°C/W
W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 26. Actual results
are dependent on mounting method and surface related to the design.
? 2009 Fairchild Semiconductor Corporation
FAN2106 ? Rev. 1.1.2
4
www.fairchildsemi.com
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