参数资料
型号: GP2S700HCP
厂商: Sharp Microelectronics
文件页数: 8/13页
文件大小: 0K
描述: PHOTOINTERRUPTER REFLEC 3MM SMD
产品变化通告: Internal Chip Change 04/May/2007
标准包装: 1
检测距离: 0.217"(5.5mm)
检测方法: 反射
电压 - 集电极发射极击穿(最大): 35V
电流 - 集电极 (Ic)(最大): 20mA
电流 - DC 正向(If): 50mA
输出类型: 光电晶体管
响应时间: 20µs
安装类型: 表面贴装
封装/外壳: 4-SMD
包装: 标准包装
工作温度: -25°C ~ 85°C
产品目录页面: 2776 (CN2011-ZH PDF)
其它名称: 425-1913-6
GP2S700HCP
■ Manufacturing Guidelines
● Storage and management after open
Storage condition
Storage temp.: 5 to 30 ? C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25 ? C and 70%RH
or less in humidity within 4 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30 ? C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125 ? C, 16 to 24 hours
? Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or ? x temporarily the products to substrate.
Sheet No.: D3-A02201EN
8
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