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参数资料
| 型号： | GRM2165C1HR50CD01J |
| 厂商： | Murata Electronics North America |
| 文件页数： | 166/182页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.5PF 50V NP0 0805 |
| 标准包装： | 10,000 |
| 系列： | GRM |
| 电容： | 0.50pF |
| 电压 - 额定： | 50V |
| 容差： | ±0.25pF |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.028"（0.70mm） |
| 包装： | 带卷 (TR) |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
C02E.pdf
Sep.25,2013
! Caution
Continued from the preceding page.
4-3. Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused
Table 3
Temperature Preheating Temperature
( Δ T)
Iron Tip
by the large temperature difference occurs internally, and can be
the cause of cracks. Capacitors also tend to be affected by
mechanical and thermal stress depending on the board preheating
Part Number
GJM/GQM/GR3/
of Soldering Differential Atmosphere
Temperature
temperature or the soldering fillet shape, and can be the cause
of cracks. Please refer to "1. PCB Design" or "3. Optimum solder
amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
GRJ/GRM Series
03/15/18/21/31 sizes
GRJ/GRM Series
32/43/55 sizes
GQM Series
350°C max. 150°C min. Δ T V 190°C
280°C max. 150°C min. Δ T V 130°C
Air
Air
1-1. In order to reduce damage to the capacitor, be sure to
preheat the capacitor and the mounting board. Preheat to
the temperature range shown in Table 3. A hot plate, hot
air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool
down repidly.
1-3. Perform the corrections with a soldering iron as quickly
as possible. If the soldering iron is applied too long, there
is a possibility of causing solder leaching on the terminal
electrodes, which will cause deterioration of the adhesive
strength and other problems.
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air
heating by a spot heater heats the overall component and
board, therefore, it tends to lessen the thermal shock. In the
case of a high density mounted board, a spot heater can also
prevent concerns of the soldering iron making direct contact
with the component.
2-1. If the distance from the hot air outlet of the spot heater to
22 size
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Table 4
the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the
Distance
Hot Air Application angle
5mm or more
45° *Figure 1
conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is
recommended that hot air be applied at the angle shown
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
(1206 (3216 in mm) size or smaller)
Application Time
Less than 30 seconds
(1210 (3225 in mm) size or larger)
[Figure 1]
in Figure 1.
One-hole Nozzle
an Angle of 45°
3. Optimum solder amount when re-working with a soldering iron
3-1. In the case of sizes smaller than 0603, (GJM/GQM/GR3/
GRJ/GRM Series, 03/15/18 sizes), the top of the solder
fillet should be lower than 2 / 3 of the thickness of the
component or 0.5mm, whichever is smaller. In the case
of 0805 and larger sizes, (GJM/GQM/GR3/GRJ/
Solder Amount
in section
GRM Series, 21/22/31/32/43/55 sizes), the top of the
solder fillet should be lower than 2 / 3 of the thickness of
the component. If the solder amount is excessive, the risk
of cracking is higher during board bending or under any
other stressful condition.
Continued on the following page.
147
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相关代理商/技术参数 |
参数描述 |
|---|---|
| GRM2165C1HR50CD01K | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD01L | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD31B | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD31D | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD31J | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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