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参数资料
| 型号： | GRM2165C1HR50CD01J |
| 厂商： | Murata Electronics North America |
| 文件页数： | 172/182页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.5PF 50V NP0 0805 |
| 标准包装： | 10,000 |
| 系列： | GRM |
| 电容： | 0.50pF |
| 电压 - 额定： | 50V |
| 容差： | ±0.25pF |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.028"（0.70mm） |
| 包装： | 带卷 (TR) |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
C02E.pdf
Sep.25,2013
Notice
c Rating
1. Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the upper
operating temperature.
It is necessary to select a capacitor with a suitable
rated temperature that will cover the operating
temperature range.
It is also necessary to consider the temperature
distribution in equipment and the seasonal
temperature variable factor.
1-2. Consider the self-heating factor of the capacitor.
The surface temperature of the capacitor shall be
the upper operating temperature or less when
including the self-heating factors.
2. Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable,
c Soldering and Mounting
1. PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
Pattern Forms
Prohibited
Chassis
Solder (ground)
operating environments may deteriorate due to
the corrosion of the terminations and the
penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur
when the electrodes or terminals of the capacitor
are subject to moisture condensation.
1-3. The deterioration of characteristics and insulation
resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when
the capacitor is exposed to corrosive or volatile
gases or solvents for long periods of time.
3. Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in
AC or pulse circuits, the capacitor itself vibrates at
specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is
added to the capacitor, noise may occur.
1-2. There is a possibility of chip cracking caused by PCB
expansion/contraction with heat, because stress on a
chip is different depending on PCB material and
structure. When the thermal expansion coefficient
greatly differs between the board used for mounting
and the chip, it will cause cracking of the chip due to
the thermal expansion and contraction. When small
size capacitors of 1005 size or less are mounted on a
single-layered glass epoxy board, it will also cause
cracking of the chip for the same reason.
Correct
Solder Resist
Placing Close to Chassis
Electrode Pattern
Lead Wire
Solder Resist
Placing
of Chip Components
and Leaded Components
Soldering Iron
Placing
of Leaded Components
Lead Wire
Solder Resist
after Chip Component
Solder Resist
Lateral Mounting
Continued on the following page.
153
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相关代理商/技术参数 |
参数描述 |
|---|---|
| GRM2165C1HR50CD01K | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD01L | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD31B | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD31D | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| GRM2165C1HR50CD31J | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0805 0.50pF 50volt C0G +/-0.25pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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