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参数资料
| 型号： | GS8662QT10BD-200I |
| 厂商： | GSI TECHNOLOGY |
| 元件分类： | SRAM |
| 英文描述： | 8M X 9 QDR SRAM, 0.45 ns, PBGA165 |
| 封装： | 13 X 15 MM, 1 MM PITCH, FPBGA-165 |
| 文件页数： | 5/29页 |
| 文件大小： | 303K |
| 代理商： | GS8662QT10BD-200I |
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GS8662QT07/10/19/37BD-357/333/300/250/200
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.00 5/2011
13/29
2011, GSI Technology
Thermal Impedance
Package
Test PCB
Substrate
JA (C°/W)
Airflow = 0 m/s
JA (C°/W)
Airflow = 1 m/s
JA (C°/W)
Airflow = 2 m/s
JB (C°/W)
JC (C°/W)
165 BGA
4-layer
22.300
18.572
17.349
9.292
2.310
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. Be advised that a good thermal path to
the PCB can result in cooling or heating of the RAM depending on PCB temperature.
HSTL I/O DC Input Characteristics
Parameter
Symbol
Min
Max
Units
Notes
Input Reference Voltage
VREF
VDDQ /2 – 0.05
VDDQ /2 + 0.05
V—
Input High Voltage
VIH1
VREF + 0.1
VDDQ + 0.3
V1
Input Low Voltage
VIL1
–0.3
VREF – 0.1
V1
Input High Voltage
VIH2
0.7 * VDDQ
VDDQ + 0.3
V2,3
Input Low Voltage
VIL2
–0.3
0.3 * VDDQ
V2,3
Notes:
1. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.
2. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.
3. Parameters apply to ZQ during JTAG boundary scan testing only.
HSTL I/O AC Input Characteristics
Parameter
Symbol
Min
Max
Units
Notes
Input Reference Voltage
VREF
VDDQ /2 – 0.08
VDDQ /2 + 0.08
V—
Input High Voltage
VIH1
VREF + 0.2
VDDQ + 0.5
V1,2,3
Input Low Voltage
VIL1
–0.5
VREF – 0.2
V1,2,3
Input High Voltage
VIH2
VDDQ – 0.2
VDDQ + 0.5
V4,5
Input Low Voltage
VIL2
–0.5
0.2
V
4,5
Notes:
1. VIH(MAX) and VIL(MIN) apply for pulse widths less than one-quarter of the cycle time.
2. Input rise and fall times must be a minimum of 1 V/ns, and within 10% of each other.
3. Parameters apply to K, K, SA, D, R, W, BW during normal operation and JTAG boundary scan testing.
4. Parameters apply to Doff, ODT during normal operation and JTAG boundary scan testing.
5. Parameters apply to ZQ during JTAG boundary scan testing only.
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相关代理商/技术参数 |
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| GS8662R08BD-167 | 制造商:GSI Technology 功能描述:GS8662R08BD-167 - Trays |
| GS8662R08BD-200 | 制造商:GSI Technology 功能描述:GS8662R08BD-200 - Trays |
| GS8662R08BD-200I | 制造商:GSI Technology 功能描述:GS8662R08BD-200I - Trays |
| GS8662R08E | 制造商:GSI 制造商全称:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM |
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