参数资料
型号: GS8662QT10BD-200I
厂商: GSI TECHNOLOGY
元件分类: SRAM
英文描述: 8M X 9 QDR SRAM, 0.45 ns, PBGA165
封装: 13 X 15 MM, 1 MM PITCH, FPBGA-165
文件页数: 6/29页
文件大小: 303K
代理商: GS8662QT10BD-200I
GS8662QT07/10/19/37BD-357/333/300/250/200
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.00 5/2011
14/29
2011, GSI Technology
AC Test Load Diagram
Capacitance
(TA = 25oC, f = 1 MHZ, VDD = 1.8 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Input Capacitance
CIN
VIN = 0 V
45
pF
Output Capacitance
COUT
VOUT = 0 V
67
pF
Clock Capacitance
CCLK
VIN = 0 V
56
pF
Note:
This parameter is sample tested.
AC Test Conditions
Parameter
Conditions
Input high level
1.25
Input low level
0.25 V
Max. input slew rate
2 V/ns
Input reference level
0.75
Output reference level
VDDQ/2
Note:
Test conditions as specified with output loading as shown unless otherwise noted.
Input and Output Leakage Characteristics
Parameter
Symbol
Test Conditions
Min.
Max
Input Leakage Current
(except mode pins)
IIL
VIN = 0 to VDD
–2 uA
2 uA
Doff
IILDOFF
VIN = 0 to VDD
–20 uA
2 uA
ODT
IIL ODT
VIN = 0 to VDD
–2 uA
20 uA
Output Leakage Current
IOL
Output Disable,
VOUT = 0 to VDDQ
–2 uA
2 uA
DQ
VT == 0.75 V
50
RQ = 250
(HSTL I/O)
VREF = 0.75 V
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