参数资料
型号: GS8662QT10BGD-250T
厂商: GSI TECHNOLOGY
元件分类: SRAM
英文描述: 8M X 9 QDR SRAM, 0.45 ns, PBGA165
封装: 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
文件页数: 7/29页
文件大小: 303K
代理商: GS8662QT10BGD-250T
GS8662QT07/10/19/37BD-357/333/300/250/200
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.00 5/2011
15/29
2011, GSI Technology
Programmable Impedance HSTL Output Driver DC Electrical Characteristics
Parameter
Symbol
Min.
Max.
Units
Notes
Output High Voltage
VOH1
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
1, 3
Output Low Voltage
VOL1
VDDQ/2 – 0.12
VDDQ/2 + 0.12
V
2, 3
Output High Voltage
VOH2
VDDQ – 0.2
VDDQ
V
4, 5
Output Low Voltage
VOL2
Vss
0.2
V
4, 6
Notes:
1.
IOH = (VDDQ/2) / (RQ/5) +/– 15% @ VOH = VDDQ/2 (for: 175 RQ 350
2.
IOL = (VDDQ/2) / (RQ/5) +/– 15% @ VOL = VDDQ/2 (for: 175 RQ 350.
3. Parameter tested with RQ = 250
and VDDQ = 1.5 V
4. 0
RQ
5. IOH = –1.0 mA
6. IOL = 1.0 mA
Operating Currents
Parameter
Symbol
Test Conditions
-357
-333
-300
-250
-200
Notes
0
to
70°C
40
to
85°C
0
to
70°C
40
to
85°C
0
to
70°C
40
to
85°C
0
to
70°C
40
to
85°C
0
to
70°C
40
to
85°C
Operating Current
(x36): DDR
IDD
VDD = Max, IOUT = 0 mA
Cycle Time
tKHKH Min
1195
mA
1205
mA
1100
mA
1110
mA
1060
mA
1070
mA
895
mA
905
mA
740
mA
750
mA
2, 3
Operating Current
(x18): DDR
IDD
VDD = Max, IOUT = 0 mA
Cycle Time
tKHKH Min
985
mA
995
mA
920
mA
930
mA
850
mA
860
mA
720
mA
730
mA
600
mA
610
mA
2, 3
Operating Current
(x9): DDR
IDD
VDD = Max, IOUT = 0 mA
Cycle Time
tKHKH Min
985
mA
995
mA
920
mA
930
mA
850
mA
860
mA
720
mA
730
mA
600
mA
610
mA
2, 3
Operating Current
(x8): DDR
IDD
VDD = Max, IOUT = 0 mA
Cycle Time
tKHKH Min
985
mA
995
mA
920
mA
930
mA
850
mA
860
mA
720
mA
730
mA
600
mA
610
mA
2, 3
Standby Current
(NOP): DDR
ISB1
Device deselected,
IOUT = 0 mA, f = Max,
All Inputs
0.2 V or VDD – 0.2 V
275
mA
285
mA
270
mA
280
mA
255
mA
265
mA
240
mA
250
mA
220
mA
230
mA
2, 4
Notes:
1.
Power measured with output pins floating.
2.
Minimum cycle, IOUT = 0 mA
3.
Operating current is calculated with 50% read cycles and 50% write cycles.
4.
Standby Current is only after all pending read and write burst operations are completed.
相关PDF资料
PDF描述
GS8662T06BD-350I 8M X 8 DDR SRAM, 0.45 ns, PBGA165
GS8662T06BD-350T 8M X 8 DDR SRAM, 0.45 ns, PBGA165
GS8672Q38BE-500I 2M X 36 QDR SRAM, 0.45 ns, PBGA165
GS880F32AGT-5.5IT 256K X 32 CACHE SRAM, 5.5 ns, PQFP100
GS880F32BGT-7IT 256K X 32 CACHE SRAM, 7 ns, PQFP100
相关代理商/技术参数
参数描述
GS8662R08BD-167 制造商:GSI Technology 功能描述:GS8662R08BD-167 - Trays
GS8662R08BD-200 制造商:GSI Technology 功能描述:GS8662R08BD-200 - Trays
GS8662R08BD-200I 制造商:GSI Technology 功能描述:GS8662R08BD-200I - Trays
GS8662R08E 制造商:GSI 制造商全称:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM
GS8662R08E-167 制造商:GSI 制造商全称:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM