参数资料
| 型号： | HFA1113IBZ |
| 厂商： | Intersil |
| 文件页数： | 8/16页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER 850MHZ 8-SOIC |
| 标准包装： | 98 |
| 放大器类型： | 缓冲器 |
| 电路数： | 1 |
| 转换速率： | 2400 V/µs |
| -3db带宽： | 850MHz |
| 电流 - 输入偏压： | 25µA |
| 电压 - 输入偏移： | 8000µV |
| 电流 - 电源： | 21mA |
| 电流 - 输出 / 通道： | 60mA |
| 电压 - 电源，单路/双路(±)： | 9 V ~ 11 V，±4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
16
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN1342.6
July 11, 2005
Die Characteristics
DIE DIMENSIONS:
63 mils x 44 mils x 19 mils
1600
m x 1130m x 483m
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8k
±0.4k
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16k
±0.8k
PASSIVATION:
Type: Nitride
Thickness: 4k
±0.5k
TRANSISTOR COUNT:
52
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1113
NC
V-
VL
NC
OUT
+IN
-IN
VH
V+
HFA1113
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| HSP-3 | THERMAL PAD TRIPLE PHASE |
| HSP-5 | THERMAL PAD 3-PHASE W/ADHESIVE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HFA1113IBZ96 | 功能描述:运算放大器 - 运放 W/ANNEAL BUFR 850MHZ CFB PRG-GAIN CLMP RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| HFA1113IP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1113MJ/883 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1113ML/883 | 制造商:Intersil Corporation 功能描述:SP AMP BFFR AMP SGL 20CLCC - Rail/Tube |
| HFA1114 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:850MHz Video Cable Driving Buffer |
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