参数资料
| 型号： | HFA1130IBZ |
| 厂商： | Intersil |
| 文件页数： | 4/13页 |
| 文件大小： | 0K |
| 描述： | IC OP AMP 850MHZ CFB 8-SOIC |
| 标准包装： | 98 |
| 放大器类型： | 电流反馈 |
| 电路数： | 1 |
| 转换速率： | 2300 V/µs |
| -3db带宽： | 850MHz |
| 电流 - 输入偏压： | 25µA |
| 电压 - 输入偏移： | 2000µV |
| 电流 - 电源： | 21mA |
| 电流 - 输出 / 通道： | 60mA |
| 电压 - 电源，单路/双路(±)： | ±4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
| 产品目录页面： | 1234 (CN2011-ZH PDF) |
12
FN3369.5
April 25, 2013
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
Die Characteristics
Metallization Mask Layout
HFA1130
DIE DIMENSIONS:
63 mils x 44 mils x 19 mils
1600m x 1130m
METALLIZATION:
Type: Metal 1: AlCu(2%)/TiW
Thickness: Metal 1: 8k
±0.4k
Type: Metal 2: ALCu(2%)
Thickness: Metal 2: 16k
±0.8k
PASSIVATION:
Type: Nitride
Thickness: 4k
±0.5k
TRANSISTOR COUNT:
52
SUBSTRATE POTENTIAL (Powered Up):
Floating (Recommend Connection to V-)
+IN
V-
VL
BAL
OUT
-IN
BAL
VH
V+
HFA1130
相关PDF资料 |
PDF描述 |
|---|---|
| HFA1412IP | IC BUFFER QUAD 350MHZ LP 14-DIP |
| HS18 | HEATSINK 12P PDIP |
| HSP-3 | THERMAL PAD TRIPLE PHASE |
| HSP-5 | THERMAL PAD 3-PHASE W/ADHESIVE |
| ICL7612BCPAZ | IC OPAMP LOW PWR 1.4MHZ 8-DIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HFA1130IBZ | 制造商:Intersil Corporation 功能描述:Operational Amplifier (Op-Amp) IC |
| HFA1130IBZ-T | 功能描述:运算放大器 - 运放 W/ANL OPAMP 850MHZ CFB CLMP IND RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| HFA1130IJ | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA1130IP | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HFA-1130IP | 制造商:Harris Corporation 功能描述: |
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