参数资料
| 型号： | HI5812KIB |
| 厂商： | Intersil |
| 文件页数： | 8/16页 |
| 文件大小： | 0K |
| 描述： | ADC 12BIT 50KSPS 1LSB 24-SOIC |
| 标准包装： | 30 |
| 位数： | 12 |
| 采样率（每秒）： | 50k |
| 数据接口： | 并联 |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 25mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC |
| 包装： | 管件 |
| 输入数目和类型： | 1 个单端，单极 |
16
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
HI5812
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
0.25(0.010)
B
M
α
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N24
24
7
α
0o
8o
0o
8o
-
Rev. 0 12/93
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HI5812KIBZ | 功能描述:ADC 12BIT 50KSPS 1LSB 24-SOIC RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 位数:12 采样率（每秒）:3M 数据接口:- 转换器数目:- 功率耗散（最大）:- 电压电源:- 工作温度:- 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-23-6 包装:带卷 (TR) 输入数目和类型:- |
| HI5812KIJ | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:CMOS 20 Microsecond, 12-Bit, Sampling A/D Converter with Internal Track and Hold |
| HI5812KIP | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:CMOS 20 Microsecond, 12-Bit, Sampling A/D Converter with Internal Track and Hold |
| HI5812KIPS2267 | 制造商:Harris Corporation 功能描述: 制造商:Intersil Corporation 功能描述: |
| HI5813 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:CMOS 3.3V, 25 Microsecond, 12-Bit, Sampling A/D Converter with Internal Track and Hold |
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