参数资料
| 型号： | HI5828IN |
| 厂商： | Intersil |
| 文件页数： | 4/12页 |
| 文件大小： | 0K |
| 描述： | DAC DUAL 12BIT 130MHZ 48-LQFP |
| 标准包装： | 250 |
| 设置时间： | 35ns |
| 位数： | 12 |
| 数据接口： | 并联 |
| 转换器数目： | 2 |
| 电压电源： | 模拟和数字 |
| 功率耗散（最大）： | 280mW |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-LQFP |
| 供应商设备封装： | 48-TQFP（7x7） |
| 包装： | 托盘 |
| 输出数目和类型： | 2 电流，单极 |
| 采样率（每秒）： | 130M |
IDT / ICS VCXO-TO-LVCMOS OUTPUTS
12
ICS81006AK REV. B OCTOBER 8, 2008
ICS81006
VCXO-TO-6 LVCMOS OUTPUTS
FIGURE 3. P.C.ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
VFQFN EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electr ical perfor mance, a land patter n must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in
Figure 3. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias.
The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”)
are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended
to determine the minimum number needed. Maximum thermal
and electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as
many vias connected to ground as possible. It is also
recommended that the via diameter should be 12 to 13mils (0.30
to 0.33mm) with 1oz copper via barrel plating. This is desirable to
avoid any solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed pad/
slug and the thermal land. Precautions should be taken to
eliminate any solder voids between the exposed heat slug and
the land pattern. Note: These recommendations are to be used
as a guideline only. For further information, refer to the Application
Note on the
Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadfame Base Package, Amkor Technology.
THERMAL VIA
LAND PATTERN
SOLDER
PIN
SOLDER
PIN PAD
PIN
GROUND PLANE
EXPOSED HEAT SLUG
(GROUND PAD)
相关PDF资料 |
PDF描述 |
|---|---|
| HI5860IBZ | CONV D/A 12-BIT 130MSPS 28-SOIC |
| HI5960IAZ | CONV D/A 14BIT 130MSPS 28-TSSOP |
| HI7188IN | CONV A/D 16BIT 8:1 MUX 44-MQFP |
| HI7190IP | IC ADC 24BIT PROGBL SER 20-PDIP |
| HI7191IP | IC ADC 24BIT PROGBL SER 20-PDIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| HI5860 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 125MSPS, CommLinkTM High Speed D/A Converter |
| HI5860 WAF | 制造商:Intersil Corporation 功能描述: |
| HI5860_05 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 130MSPS, High Speed D/A Converter |
| HI5860_08 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 130MSPS, High Speed D/A Converter |
| HI5860IA | 功能描述:CONV D/A 12BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
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