参数资料
| 型号： | HIP1013EVAL1 |
| 厂商： | Intersil |
| 文件页数： | 8/8页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD DUAL GENERIC |
| 标准包装： | 1 |
| 主要目的： | 电源管理，热交换控制器 |
| 已用 IC / 零件： | HIP1013 |
| 已供物品： | 板 |
HIP1013
Small Outline Plastic Packages (SOIC)
N
M14.15 (JEDEC MS-012-AB ISSUE C)
INDEX
AREA
E
H
0.25(0.010) M
B M
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
INCHES
MILLIMETERS
-B-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
1
2
3
L
A
A1
0.0532
0.0040
0.0688
0.0098
1.35
0.10
1.75
0.25
-
-
SEATING PLANE
B
0.013
0.020
0.33
0.51
9
-A-
D
A
h x 45 o
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
e
B
-C-
A1
μ α
0.10(0.004)
C
E
e
H
h
0.1497 0.1574
0.050 BSC
0.2284 0.2440
0.0099
0.0196
3.80 4.00
1.27 BSC
5.80 6.20
0.25
0.50
4
-
-
5
0.25(0.010) M
C A M
B S
L
0.016
0.050
0.40
1.27
6
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
N
α
0 o
14
8 o
0 o
14
8 o
7
-
Publication Number 95.
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
8
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP1013EVAL2 | 功能描述:电源管理IC开发工具 GENERIC HIP1013 RAID EVALUATION BRD RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| HIP1015 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Power Distribution Controllers |
| HIP1015_03 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Power Distribution Controllers |
| HIP1015CB | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HIP1015CB-T | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Power Distribution Controllers |
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