参数资料
型号: HIP6004ECVZ-T
厂商: Intersil
文件页数: 12/13页
文件大小: 0K
描述: IC CTRLR PWM VOLTAGE MON 20TSSOP
标准包装: 2,500
应用: 控制器,Intel VRM8.5
输入电压: 5V,12V
输出数: 1
输出电压: 1.05 V ~ 1.825 V
工作温度: 0°C ~ 70°C
安装类型: *
封装/外壳: 20-TSSOP(0.173",4.40mm 宽)
供应商设备封装: *
包装: 带卷 (TR)
HIP6004E
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E1
E
0.25(0.010) M
GAUGE
B M
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES MILLIMETERS
-B-
PLANE
SYMBOL
MIN
MAX
MIN
MAX
NOTES
1
2
3
L
A
A1
-
0.002
0.047
0.006
-
0.05
1.20
0.15
-
-
-A-
0.05(0.002)
D
SEATING PLANE
A
0.25
0.010
A2
b
c
0.031
0.0075
0.0035
0.051
0.0118
0.0079
0.80
0.19
0.09
1.05
0.30
0.20
-
9
-
e
b
0.10(0.004) M
-C-
C A M
B S
A1
α
0.10(0.004)
A2
c
D
E1
e
E
L
0.252 0.260
0.169 0.177
0.026 BSC
0.246
0.256
0.0177
0.0295
6.40 6.60
4.30 4.50
0.65 BSC
6.25
6.50
0.45
0.75
3
4
-
-
6
N
20
20
7
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
α
0 o
8 o
0 o
8 o
-
Rev. 1 6/98
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
12
相关PDF资料
PDF描述
ECA50DTBD CONN EDGECARD 100PS R/A .125 SLD
2510-10K INDUCTOR RF .27UH UNSHIELDED SMD
ISL6310IRZ-T IC CTRLR PWM 2PHASE BUCK 32-QFN
ECA49DTAS CONN EDGECARD 98POS R/A .125 SLD
2510-08K INDUCTOR RF .22UH UNSHIELDED SMD
相关代理商/技术参数
参数描述
HIP6004EVAL1 功能描述:EVALUATION BOARD HIP6004 RoHS:否 类别:编程器,开发系统 >> 过时/停产零件编号 系列:- 标准包装:1 系列:- 传感器类型:CMOS 成像,彩色(RGB) 传感范围:WVGA 接口:I²C 灵敏度:60 fps 电源电压:5.7 V ~ 6.3 V 嵌入式:否 已供物品:成像器板 已用 IC / 零件:KAC-00401 相关产品:4H2099-ND - SENSOR IMAGE WVGA COLOR 48-PQFP4H2094-ND - SENSOR IMAGE WVGA MONO 48-PQFP
HIP6004EVAL3 功能描述:电源管理IC开发工具 EMBEDDED EVAL BRD SYNC BUCK/KLAM RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V
HIP6005 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Buck Pulse-Width Modulator (PWM) Controller and Output Voltage Monitor
HIP6005A 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Buck Pulse-Width Modulator (PWM) Controller and Output Voltage Monitor
HIP6005ACB 制造商:Rochester Electronics LLC 功能描述:- Bulk