参数资料
| 型号： | HIP6006CBZ |
| 厂商： | Intersil |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC PWM CTRLR/VOLT OUT MON 14SOIC |
| 标准包装： | 500 |
| 应用： | 控制器，Intel Pentium? Pro、PowerP、Alpha |
| 输入电压： | 5V，12V |
| 输出数： | 1 |
| 输出电压： | 1.3 V ~ 12 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | * |
| 封装/外壳： | 14-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | * |
| 包装： | 管件 |
HIP6006
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E1
-B-
E
0.25(0.010) M
GAUGE
PLANE
B M
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX
NOTES
1
2
-A-
3
0.05(0.002)
D
SEATING PLANE
A
0.25
0.010
L
A
A1
A2
b
c
-
0.002
0.031
0.0075
0.0035
0.047
0.006
0.051
0.0118
0.0079
-
0.05
0.80
0.19
0.09
1.20
0.15
1.05
0.30
0.20
-
-
-
9
-
e
b
0.10(0.004) M
-C-
C A M
B S
A1
α
0.10(0.004)
A2
c
D
E1
e
E
L
0.195 0.199
0.169 0.177
0.026 BSC
0.246 0.256
0.0177
0.0295
4.95 5.05
4.30 4.50
0.65 BSC
6.25 6.50
0.45
0.75
3
4
-
-
6
N
14
14
7
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AC, Issue E.
α
0 o
8 o
0 o
8 o
-
Rev. 1 6/00
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6006CBZ-T | 功能描述:电压模式 PWM 控制器 PWMCNTRLR SYNCBUCK-14 RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| HIP6006CBZ-TS2462 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intersil Corporation 功能描述: |
| HIP6006CV | 功能描述:IC CTRLR PWM VOLT MODE 14-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| HIP6006CV-T | 功能描述:IC CTRLR PWM VOLT MODE 14-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,000 系列:- 应用:电源，ICERA E400，E450 输入电压:4.1 V ~ 5.5 V 输出数:10 输出电压:可编程 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:42-WFBGA，WLCSP 供应商设备封装:42-WLP 包装:带卷 (TR) |
| HIP6006CV-TS2462 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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