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| 型号： | HIP6301VCB-T |
| 厂商： | Intersil |
| 文件页数： | 16/20页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM 20-SOIC |
| 标准包装： | 1,000 |
| PWM 型： | 控制器 |
| 输出数： | 4 |
| 频率 - 最大： | 336kHz |
| 电源电压： | 4.75 V ~ 5.25 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 包装： | 带卷 (TR) |
HIP6301V, HIP6302V
+5VIN
+12V
USE INDIVIDUAL METAL RUNS
FOR EACH CHANNEL TO HELP
ISOLATE OUTPUT STAGES
CBP
VCC PVCC
LOCATE NEXT TO IC PIN(S)
CBOOT
CIN
LOCATE NEAR TRANSISTOR
C BP
V CC
PWM
HIP6601
LO1
VCORE
C T
R FB
COMP FS/DIS
HIP6301V
R T
PHASE
COUT
LOCATE NEXT
TO FB PIN
R IN
FB
LOCATE NEXT TO IC PIN
R SEN
KEY
VSEN
ISEN
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 13. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS
A multi-layer printed circuit board is recommended.
Figure 13 shows the connections of the critical components
for one output channel of the converter. Note that capacitors
C IN and C OUT could each represent numerous physical
capacitors. Dedicate one solid layer, (usually the middle
layer of the PC board), for a ground plane and make all
critical component ground connections with vias to this layer.
Dedicate another solid layer as a power plane and break this
plane into smaller islands of common voltage levels. Keep
the metal runs from the PHASE terminal to inductor L O1
short. The power plane should support the input power and
output power nodes. Use copper filled polygons on the top
and bottom circuit layers for the phase nodes. Use the
remaining printed circuit layers for small signal wiring. The
wiring traces from the driver IC to the MOSFET gate and
source should be sized to carry at least one ampere of
current.
Component Selection Guidelines
Output Capacitor Selection
The output capacitor is selected to meet both the dynamic
load requirements and the voltage ripple requirements. The
load transient for the microprocessor CORE is characterized
by high slew rate (di/dt) current demands. In general,
multiple high quality capacitors of different size and dielectric
are paralleled to meet the design constraints.
Modern microprocessors produce severe transient load rates.
High frequency capacitors supply the initially transient current
and slow the load rate-of-change seen by the bulk capacitors.
The bulk filter capacitor values are generally determined by
the ESR (effective series resistance) and voltage rating
requirements rather than actual capacitance requirements.
16
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors. The
bulk capacitor ’s ESR determines the output ripple voltage
and the initial voltage drop following a high slew-rate
transient’s edge. In most cases, multiple capacitors of small
case size perform better than a single large case capacitor.
Bulk capacitor choices include aluminum electrolytic,
OS-Con, Tantalum and even ceramic dielectrics. An
aluminum electrolytic capacitor ’s ESR value is related to the
case size with lower ESR available in larger case sizes.
However, the equivalent series inductance (ESL) of these
capacitors increases with case size and can reduce the
usefulness of the capacitor to high slew-rate transient
loading. Unfortunately, ESL is not a specified parameter.
Consult the capacitor manufacturer and measure the
capacitor ’s impedance with frequency to select a suitable
component.
Output Inductor Selection
One of the parameters limiting the converter ’s response to a
load transient is the time required to change the inductor
current. Small inductors in a multi-phase converter reduce
the response time without significant increases in total ripple
current.
The output inductor of each power channel controls the
ripple current. The control IC is stable for channel ripple
current (peak-to-peak) up to twice the average current. A
FN9034.3
May 5, 2008
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HIP6301VCB-TS2490 | 制造商:Intersil Corporation 功能描述: |
| HIP6301VCBZ | 功能描述:电流型 PWM 控制器 MULTI-PHS CNTRLR VID ON THE FLYINTEL VID RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| HIP6301VCBZA | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301VCBZA-T | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Microprocessor CORE Voltage Regulator Multi-Phase Buck PWM Controller |
| HIP6301VCBZ-T | 功能描述:电流型 PWM 控制器 MULTI-PHS CNTRLR VID ON THE FLYINTEL VID RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
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