参数资料
型号: HIP6602BCR
厂商: Intersil
文件页数: 5/12页
文件大小: 0K
描述: IC DRVR MOSF 2CH SYC BUCK 16-QFN
标准包装: 60
配置: 高端和低端,同步
输入类型: PWM
电流 - 峰: 400mA
配置数: 2
输出数: 4
高端电压 - 最大(自引导启动): 15V
电源电压: 10.8 V ~ 13.2 V
工作温度: 0°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-VQFN 裸露焊盘
供应商设备封装: 16-QFN-EP(5x5)
包装: 管件
HIP6602B
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V BOOT - V PHASE ) . . . . . . . . . . . . . . . . . . . . . . .15V
Input Voltage (V PWM ) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . .V PHASE - 5V(<400ns pulse width) to V BOOT + 0.3V
V PHASE -0.3V(>400ns pulse width) to V BOOT + 0.3V
LGATE . . . . . . . . . GND - 5V(<400ns pulse width) to V PVCC + 0.3V
GND -0.3V(>400ns pulse width) to V PVCC + 0.3V
PHASE. . . . . . . . . . . . . . . . . . GND -5V(<400ns pulse width) to 15V
GND -0.3V(>400ns pulse width) to 15V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . .3kV
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . .200V
Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . 0°C to 85°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V ± 10%
Supply Voltage Range PVCC . . . . . . . . . . . . . . . . . . . . . 5V to 12V
Thermal Information
Thermal Resistance θ JA (°C/W) θ JC (°C/W)
SOIC Package (Note 2) . . . . . . . . . . . . 68 N/A
QFN Package (Note 3). . . . . . . . . . . . . 36 6
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ JC, the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
Recommended Operating Conditions, unless otherwise specified.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Bias Supply Current
Power Supply Current
I VCC
I PVCC
f PWM = 500kHz, V PVCC = 12V
f PWM = 500kHz, V PVCC = 12V
-
-
3.7
2.0
5.0
4.0
mA
mA
POWER-ON RESET
VCC Rising Threshold
VCC Falling Threshold
9.7
7.3
9.95
7.6
10.4
8.0
V
V
PWM INPUT
Input Current
PWM Rising Threshold
PWM Falling Threshold
UGATE Rise Time
LGATE Rise Time
UGATE Fall Time
LGATE Fall Time
I PWM
TR UGATE
TR LGATE
TF UGATE
TF LGATE
V PWM = 0 or 5V (See Block Diagram)
V PVCC = 12V
V PVCC = 12V
V PVCC = V VCC = 12V, 3nF Load
V PVCC = V VCC = 12V, 3nF Load
V PVCC = V VCC = 12V, 3nF Load
V PVCC = V VCC = 12V, 3nF Load
-
-
-
-
-
-
-
500
3.6
1.45
20
50
20
20
-
-
-
-
-
-
-
μA
V
V
ns
ns
ns
ns
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
Shutdown Window
Shutdown Holdoff Time
TPDL UGATE V PVCC = V VCC = 12V, 3nF Load
TPDL LGATE V PVCC = V VCC = 12V, 3nF Load
-
-
1.4
-
30
20
-
230
-
-
3.6
-
ns
ns
V
ns
OUTPUT
Upper Drive Source Impedance
Upper Drive Sink Impedance
Lower Drive Source Current
Lower Drive Sink Impedance
R UGATE
R UGATE
I LGATE
R LGATE
V VCC = 12V, V PVCC = 5V
V VCC = V PVCC = 12V
V VCC = 12V, V PVCC = 5V
V VCC = V PVCC = 12V
V VCC = 12V, V PVCC = 5V
V VCC = V PVCC = 12V
V VCC = 12V, V PVCC = 5V or 12V
-
-
-
-
400
500
-
1.7
3.0
2.3
1.1
580
730
1.6
3.0
5.0
4.0
2.0
-
-
4.0
?
?
?
?
mA
mA
?
5
FN9076.5
July 22, 2005
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