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参数资料
| 型号： | HK16083N9S-T |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.0039 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP, 1608 |
| 文件页数： | 6/19页 |
| 文件大小： | 1023K |
| 代理商： | HK16083N9S-T |
PRECAUTIONS
FERRITE
PRODUCTS
5
257
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
2 Examples of good and bad solder application
Not recommended
Recommended
2.PCB Design
Not recommended
Recommended
Deection of
the board
Mixed mount-
ing of SMD and
leaded compo-
nents
C o m p o n e n t
placement close
to the chassis
Hand-soldering
o f l e a d e d
c o m p o n e n t s
near mounted
components
Horizontal com-
ponent place-
ment
Pattern congurations
Inductor layout on panelized breakaway PC boards
1. After inductors have been mounted on the boards,
chips can be subjected to mechanical stresses in sub-
sequent manufacturing processes PCB cutting, board
inspection, mounting of additional parts, assembly into
the chassis, wave soldering the reow soldered boards
etc.
For this reason, planning pattern congurations
and the position of SMD inductors should be carefully
performed to minimize stress.
1-1. The following are examples of good and bad inductor layout; SMD induc-
tors should be located to minimize any possible mechanical stresses from
board warp or deection.
Item
1-2. To layout the inductors for the breakaway PC board, it should be noted
that the amount of mechanical stresses given will vary depending on in-
ductor layout. An example below should be counted for better design.
1-3. When breaking PC boards along their perforations, the amount of me-
chanical stress on the inductors can vary according to the method used.
The following methods are listed in order from least stressful to most
stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal
SMD inductor layout must also consider the PCB splitting procedure.
2/7
Stages
Precautions
Technical considerations
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HK-1608-3N9STK | 功能描述:固定电感器 3.9nH 300mA 0.3nH RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK160847NH-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0603 47nH 3% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK160847NJ-T | 功能描述:固定电感器 INDCTR HIFREQ MLTLYR 0603 47nH 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK-1608-47NJTK | 功能描述:固定电感器 47nH 300mA 5% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| HK160847NJ-TV | 功能描述:47nH Unshielded Multilayer Inductor 210mA 700 mOhm Max 0603 (1608 Metric) 制造商:taiyo yuden 系列:HK 包装:剪切带（CT） 零件状态:过期 类型:多层 材料 - 磁芯:铁氧体 电感:47nH 容差:±5% 额定电流:210mA 电流 - 饱和值:- 屏蔽:无屏蔽 DC 电阻（DCR）:700 毫欧最大 不同频率时的 Q 值:12 @ 100MHz 频率 - 自谐振:900MHz 等级:AEC-Q200 工作温度:-40°C ~ 125°C 频率 - 测试:100MHz 安装类型:表面贴装 封装/外壳:0603（1608 公制） 大小/尺寸:0.063" 长 x 0.031" 宽（1.60mm x 0.80mm） 高度 - 安装（最大值）:0.037"（0.95mm） 标准包装:1 |
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