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参数资料
| 型号： | HK16083N9S-T |
| 厂商： | TAIYO YUDEN CO LTD |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.0039 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP, 1608 |
| 文件页数： | 8/19页 |
| 文件大小： | 1023K |
| 代理商： | HK16083N9S-T |
PRECAUTIONS
FERRITE
PRODUCTS
5
261
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
3.Considerations for
automatic placement
4.Soldering
Selection of Flux
1. Since ux may have a signicant effect on the perfor-
mance of inductors, it is necessary to verify the follow-
ing conditions prior to use;
1 Flux used should be with less than or equal to 0.1
wt% Chlorine conversion method of halogenated
content. Flux having a strong acidity content should
not be applied.
2 When soldering inductors on the board, the amount
of flux applied should be controlled at the optimum
level.
3 When using water-soluble ux, special care should be
taken to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. are specied in
accordance with the following recommended conditions.
1-1. When too much halogenated substance Chlorine, etc. content is used
to activate the ux, or highly acidic ux is used, an excessive amount of
residue after soldering may lead to corrosion of the terminal electrodes or
degradation of insulation resistance on the surface of the Inductor.
1-2. Flux is used to increase solderability in ow soldering, but if too much is
applied, a large amount of ux gas may be emitted and may detrimentally
affect solderability. To minimize the amount of ux applied, it is recom-
mended to use a ux-bubbling system.
1-3. Since the residue of water-soluble ux is easily dissolved by water content
in the air, the residue on the surface of Inductor in high humidity conditions
may cause a degradation of insulation resistance and therefore affect the
reliability of the components. The cleaning methods and the capability of the
machines used should also be considered carefully when selecting water-
soluble ux.
1-1. Preheating when soldering
Heating: Chip inductor components should be preheated to within 100 to
130
of the soldering. Cooling: The temperature difference between the
components and cleaning process should not be greater than 100 .
Chip inductors are susceptible to thermal shock when exposed to rapid or
concentrated heating or rapid cooling. Therefore, the soldering process
must be conducted with a great care so as to prevent malfunction of the
components due to excessive thermal shock.
Technical considerations
Stages
Precaution
4/7
Figure
0805 case sizes as examples
a
0.3mm min
b
100
120
m
c
Area with no adhesive
When using adhesives to mount inductors on a PCB, inappropriate amounts of
adhesive on the board may adversely affect component placement. Too little
adhesive may cause the inductors to fall off the board during the solder process.
Too much adhesive may cause defective soldering due excessive ow of adhe-
sive on to the land or solder pad.
Recommended conditions
Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads
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