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| 型号： | HMC1002-TR |
| 厂商： | Honeywell Microelectronics & Precision Sensors |
| 文件页数： | 13/15页 |
| 文件大小： | 1409K |
| 描述： | SENSOR LINEAR MAGN 2AXIS 20-SOIC |
| 产品培训模块： | Magnetic Sensors |
| 标准包装： | 1 |
| 传感范围： | ±2g |
| 类型： | 线性 |
| 电源电压： | 5 V ~ 12 V |
| 输出类型： | 差分电压 |
| 特点： | 罗盘 - 双轴 |
| 工作温度： | -55°C ~ 150°C |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 20-SOIC |
| 包装： | 散装 |
| 产品目录页面： | 2814 (CN2011-ZH PDF) |
| 其它名称： | 342-1070 342-1070-1 342-1070-ND |
HMC1001/1002/1021/1022
www.honeywell.com
13
Figure 6 Field Detector or Current Sensor
MOUNTING CONSIDERATIONS
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads.
Pick and Place
Placement is machine dependant and no restrictions are recommended.
Reflow and Rework
No special profile is required for the HMC10xx parts. The product is compatible with lead and no-lead eutectic solder
paste reflow profiles. Honeywell recommends the adherence to solder paste manufacturers guidelines. The sensors may
be reworked with soldering irons, but extreme care must be taken not to overheat the parts circuit board pads. Irons with
a tip temperature no greater than 315癈 should be used. Excessive rework risks the copper pads pulling away into the
molten solder.
1
R1
1.1K
2
R2
1.1K
R3
1.1K
R4
1.1K
VCC
VEE
4
3
6
X1A
LMV324N
R5
4.99K
R6
4.99K
R7
1MEG
C1
1N
VDD
VDD
8
R8
1MEG
16
R12
4.5
XOUT
R9
10K
17
18
14
X2
IRF7105P
C2
2.2U
X3
IRF7105N
C3
0.22U
R11
200
SR_IN
VDD
R10
10K
VDD
HMC1021
1
R1
1.1K
2
R2
1.1K
R3
1.1K
R4
1.1K
VCC
VEE
4
3
6
X1A
LMV324N
R5
4.99K
R6
4.99K
R7
1MEG
C1
1N
VDD
VDD
8
R8
1MEG
16
R12
4.5
XOUT
R9
10K
17
18
14
X2
IRF7105P
C2
2.2U
X3
IRF7105N
C3
0.22U
R11
200
SR_IN
VDD
R10
10K
VDD
HMC1021
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