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参数资料
| 型号： | HMC283LM1 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 放大器 |
| 英文描述： | 17000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | ROHS COMPLIANT, PLASTIC, SMT, 8 PIN |
| 文件页数： | 7/8页 |
| 文件大小： | 320K |
| 代理商： | HMC283LM1 |
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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The HMC LM1 package was designed to be compatible with high volume surface mount PCB assembly processes.
The LM1 package requires a specific mounting pattern to
allow proper mechanical attachment and to optimize electrical
performance at millimeterwave frequencies. The PCB layout
pattern can be found on each LM1 product data sheet. It can
also be provided as an electronic drawing upon request from
Hittite Sales & Application Engineering.
Follow these precautions to avoid permanent damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM1 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.
Static Sensitivity: Follow ESD precautions to protect against
ESD strikes.
General Handling: Handle the LM1 package on the top with
a vacuum collet or along the edges with a sharp pair of bent tweezers. Avoid damaging the RF, DC, & ground
contacts on the package bottom. Do not apply excess pressure to the top of the lid.
Solder Materials & Temperature Profile: Follow the information contained in the application note. Hand soldering is
not recommended. Conductive epoxy attachment is not recommended.
Solder Paste
Solder paste should be selected based on the user’s experience and should be compatible with the metallization
systems used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes.
Solder Paste Application
Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder
paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical &
electrical performance. Excess solder may create unwanted electrical parasitics at high frequencies.
Solder Reflow
The soldering process is usually accomplished in a reflow oven but may also use a vapor phase process. A solder
reflow profile is suggested above.
Prior to reflowing product, temperature profiles should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and
varying component masses. The final profile should be determined by mounting the thermocouple to the PCB at the
location of the device.
Follow solder paste and oven vendor’s recommendations when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to
thermal shock. Allow enough time between reaching pre-heat temperature and reflow for the solvent in the paste to
evaporate and the flux to completely activate. Reflow must then occur prior to the flux being completely driven off.
The duration of peak reflow temperature should not exceed 15 seconds. Packages have been qualified to withstand
a peak temperature of 2350C for 15 seconds. Verify that the profile will not expose the device to temperatures in
excess of 2350C.
Cleaning
A water-based flux wash may be used.
Recommended SMT Attachment Technique
Preparation & Handling of the LM1 Millimeterwave Package for Surface Mounting
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TEMPERATURE
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0 C)
TIME (min)
Recommended solder reflow profile
for HMC LM1 SMT package
HMC283LM1
SMT MEDIUM POWER GaAs MMIC
AMPLIFIER, 17 - 40 GHz
v04.1201
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| HMC291 | 700 MHz - 4000 MHz RF/MICROWAVE VARIABLE ATTENUATOR, 1.6 dB INSERTION LOSS-MAX |
| HMC292LC3B | 16000 MHz - 30000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12.5 dB CONVERSION LOSS-MAX |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| HMC283LM1_01 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz |
| HMC283LM1_06 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz |
| HMC283LM1_10 | 制造商:HITTITE 制造商全称:Hittite Microwave Corporation 功能描述:SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz |
| HMC284AMS8G | 功能描述:IC SWITCH SPDT DC-3.5GHZ 8-MSOP 制造商:analog devices inc. 系列:- 包装:剪带 零件状态:最後搶購 频率?- 下:DC 频率?- 上:3.5GHz 隔离 @ 频率:40dB @ 3.5GHz（标准） 插损 @ 频率:0.7dB @ 3.5GHz IIP3:50dBm（最小） 拓扑:吸收 电路:SPDT P1dB:29dBm（标准） IP1dB 特性:- 阻抗:50 欧姆 工作温度:-40°C ~ 85°C 电压 - 电源:- RF 类型:手机，ISM，PCS 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商器件封装:8-MSOPG 标准包装:1 |
| HMC284AMS8GE | 制造商:Hittite Microwave Corp 功能描述:IC SWITCH SPDT DC-3.5GHZ 8-MSOP |
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