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参数资料
| 型号： | HMC460LC5 |
| 厂商： | HITTITE MICROWAVE CORP |
| 元件分类： | 放大器 |
| 英文描述： | 0 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封装： | 5 X 5 MM, ROHS COMPLIANT, LEADLESS, CERAMIC, SMT, 32 PIN |
| 文件页数： | 4/6页 |
| 文件大小： | 706K |
| 代理商： | HMC460LC5 |
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343
Fax: 978-250-3373
Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
A
M
P
LI
F
IE
R
S
-
L
O
W
N
O
IS
E
-
S
M
T
7
7 - 4
Outline Drawing
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
+9 Vdc
Gate Bias Voltage (Vgg)
-2 to 0 Vdc
Gate Bias Voltage (Igg)
2.5 mA
RF Input Power (RFIN)(Vdd = +8 Vdc)
+18 dBm
Channel Temperature
175 °C
Continuous Pdiss (T = 85 °C)
(derate 23 mW/°C above 85 °C)
2 W
Thermal Resistance
(channel to package bottom)
44.4 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
Vdd (V)
Idd (mA)
+7.5
74
+8.0
75
+8.5
76
Typical Supply Current vs. Vdd
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
HMC460LC5
v03.1010
GaAs pHEMT MMIC LOW NOISE
AMPLIFIER, DC - 20 GHz
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING:
30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Pin Descriptions
Pin Number
Function
Description
Interface Schematic
1 - 4, 7 - 12,
14, 16 - 20,
23 - 29, 31
N/C
No connection. These pins may be connected to RF ground.
Performance will not be affected.
5
RFIN
This pin is DC coupled
and matched to 50 Ohms.
6, 21
GND
Package bottom must be connected to RF/DC ground.
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